Originally Posted by ksec
Well HP already has an Fanless Ultrabook running with Core i5 Haswell. Yes, Poor HP gets no coverage or reviews, it was a pretty decent built machine.
Really, first I've heard of this machine. I have to wonder about performance and how quickly it thermally throttles. Do you have a model number we can search on, somebody would have reviewed the thing if it was at all worth it by now. I just don't follow Windows world hardware unless it is known to support Windows well.
So you can be assured only better performance or even lower power from Broadwell.
If Intel lives up to its own hype, it would be foolish to purchase an Air this year. However we have seen Intel not live up to its claims and frankly they have already slipped the release of Broadwell.
And Intel has since introduce SDP, scenario design power. Which is different to TDP.
Which doesn't help at all when it comes to grasping capabilities and performance one can expect. With everything we know about processors and performance I still see a need for a very significantly sized heat sink. If Apple goes this way I can see them using the CNC'ed case as that heat sink, optimizing the case for thermal transfer. Still 7, 12 or whatever watts, is a lot of power to handle in a very enclosed space.
As I mentioned in another thread all one has to do is take a 12 watt light bulb and put it in a tight container and watch how hot that container gets. Apples challenge will be to spread that heat across the whole housing quickly. I wouldn't be surprised to find heat pipe like solutions built into the case, maybe even some newfangled carbon fiber based solutions.