Originally posted by snoopy
Thank you for the interesting information. Yes, the spurts can't be too long or the tiny bonding wires will melt like fuse links, probably just before the chip turns to jelly.
Well, there really arn't any bond wires on these chips these days. Every CPU I've seen in recent history has been flip-chip or something similar. There are no bond wires there. The die is just flipped over, and glued to the carrier, with soldier columns that contact the die pads. This is a damn cool way of mounting chips for two reasons:
The back side of the die is still exposed. This allows a heatsink to directly contact the silicon, without any packaging resistance in between. This means that there never is any 'lid' put on flip-chip packages.
The die pads don't have to be on the perimeter of the die. This allows more pads for a given chip size, and the routing on the die is easier because signals don't have to find their way to the edges.
Oh, and I would think that not having the super thin bond wires in there would increase reliability too.
And the BI ovens are designed to take all that heat away, like really
fast. Other wise the chip would