Hey, I think this stuff is cool, too!
I do think this stuff is interesting... but that isn't really why I keep harping on this. I really respect Apples design work. I even admire the design work of this fan system... but I feel like Apple "punked out". They had to make a decision about how they were going to address heat issues, now and in the near future and this decision seems like the absolute wrong direction to me. I guess I am just more disappointed than anything... I expected a step forward with the G5 in terms of design... this is like a step sideways.
fact, from an engineering standpoint, they are currently unnecessary in most cases.
When a computer is made LARGER than the previous model and has LESS internal expandability and STILL isn't silent there is something wrong IMO.
Now, in a few years when a processor module generates 300W in a few square centimeters... you might start to see some more fancy solutions--then you can resurrect this thread again and serve us all a nice fat helping of crow!
My point is that that time is already here... for the reasons I have mentioned.
Maybe this is all just part of a marketing gimmick. Maybe the "wind tunnel" was just ONE step in Apple's "heat wars". lol
In the mean time... here is a sampling of crow: :PArticle
Pumps, Not Fans, May Cool Tomorrow's Computers
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By Mike Martin
May 9, 2003
With this liquid-cooling system, in principle, computers would be able to run without a fan.
Computer sales may be cooling, but computer chips keep getting hotter, and an innovative new way to cool them uses liquid forced through micro-channels only three times the width of a human hair.
The new system may be arriving just in time -- in three years, analysts expect microprocessor chips will generate four times more heat than chips in today's personal computers.
A "pump-less" liquid-cooling system for tomorrow's computers is the brainchild of Purdue University researchers Issam Mudawar and Swaraj Mukherjee.
"Whereas current high-performance chips generate about 75 watts per square centimeter, chips in the near future will generate more than 300 watts per square centimeter," Mudawar told NewsFactor. "Any time you squeeze more circuitry into the same space, you are producing more heat per unit area and per unit volume," he added.
Tiny Bubbles Are Just Fine
The Purdue system solves two problems. Researchers previously thought bubbles might block the circulation of liquid forced to flow through such small channels. Engineers also thought electric pumps might be needed to push liquid through the narrow channels, increasing the cooling system's cost and complexity while potentially decreasing its reliability.
Instead, the two Purdue engineers discovered that liquid flows through a micro-tube easily because the bubbles are much smaller than the diameter of the tube.
"We were surprised to see that the liquid forms really miniature bubbles, so they slip through really fast," Mudawar said. "The bubbles don't block the flow, as you would expect."
The system also uses a closed-loop design that negates the need for a pump -- the liquid circulates in a self-sustaining flow that carries heat away from the computer chip .
"This new cooling method, if it can work in a reliable way for at least 50,000 hours, can certainly be a big help in electronics," said Texas A&M electrical engineering professor Laszlo Kish, a prominent expert in the field of microchip heat and power dissipation.
Fanning the FuturePresently, computers use fans and heat sinks to cool circuitry -- technology that "will not be efficient enough to remove the increasing heat generated by future chips," Mudawar said.
Chip and computer manufacturers are aware of the pending problem.
"Microprocessor makers are making strong efforts to avoid further increases in power dissipation and heat generation," Kish told NewsFactor. "For example, they are trying to design circuitry which switches off those parts of the processor not currently in use."
Efforts to reduce power loss as heat energy probably will not be enough -- hence the need for a new type of coolant.
In the fluid-cooling system, a dielectric liquid -- a liquid that does not conduct electricity -- flows through micro-channels in a metal plate touching the chip. The chip heats the liquid, producing bubbles of vapor that rise in one of two vertical, parallel tubes. At the top of the tube, a fan cools and condenses the vapor, which flows back into the tube and descends, creating a self-sustaining flow that eventually re-enters the micro-channel plate, starting the process again.
"With this liquid-cooling system
, in principle, computers would be able to run without a fan
, and everybody would be happy about that," Kish said. "I applaud this new discovery, and I think the physics behind it is interesting for further studies."