Press Release Source: Broadcom Corporation; BRCM Mobile & Wireless
Broadcom Leaps Ahead of the Competition with the World's First '3G Phone on a Chip' Solution
Monday October 15, 12:08 am ET
Over a Year Ahead of Competitors, Broadcom Introduces Single-Chip HSUPA Processor
BCM21551 Features Full CMOS RF, Rich Multimedia, Bluetooth(R), FM Radio, FM Transmitter and More, Packed on a Single 65nm Die to Slash Price, Size and Power
IRVINE, Calif., Oct. 15 /PRNewswire-FirstCall/ -- Broadcom Corporation (Nasdaq: BRCM - News), a global leader in semiconductors for wired and wireless communications, today announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die. Broadcom's new "3G Phone on a Chip" solution enables manufacturers to build next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery life, all at a fraction of the cost of today's solutions - driving widespread consumer adoption. Never before has anyone integrated as many radio devices on a single chip, which demonstrates Broadcom's technology leadership in multi-modal CMOS RF technology.........