Originally Posted by AppleInsider
Also paving the way for redesigned enclosures at this time are logic-board changes on the part of Intel that offer Apple the opportunity to reassess and slightly modify the notebooks' internals. Both the MacBook and MacBook Pro are to receive "Montevina"-based processors from the chipmaker's upcoming Centrino 2 platform, which require a new "Socket B" logic-board. The second-gen mobile Penryn chips will boast a 1066MHz front-side bus and clock between 2.26GHz and 2.8GHz.
Kasper, a major logic board change won't happen until mobile-Nehalem arrives, Spring of 2009. Apple can just use the same logic board designs in the existing MB/MBP/MBA for Montevina as that is all the same architecture: same CPU+NORTHBRIDGE+SOUTHBRIDGE, but with smaller/bigger/faster features. Same FSB, but faster. Uses a Northbridge, but comes with better graphics, it could ship with a WiMAX module if Apple so chooses. Montevina will have a raft of CPU, Northbridge and Soutbridge chip packages that would be direct drop in replacements in the MacBook Air. The MBA's Merom in a smaller chip package is actually just the Montevina small form factor packaging.
Apple may redo the MB/MBP enclosures, but it won't be because of Montevina. It could be argued that it won't be because of Nehalem either, even though basically everything is changing with the logic board for Nehalem.
Apple will have to be very careful about MB/MBP enclosure changes. Very very careful. It's their bread and butter right now, selling like gangbusters. Hopefully they'll come up with something good. (Ahem, port replicator port and docking station.)