Quote:
Originally Posted by crocodile 
I wonder whether enough space has been liberated to allow Apple to create a much slimmer and lighter enclosure for the MacBook Pro. Losing a few millimeters thickness would surely reduce the overall weight. Add the new flat keyboard and a gesture-enabled trackpad and you get some idea as to how Apple could evolve the current design to provide some useful benefits.
Does anybody know about this or have a view?

I wonder whether enough space has been liberated to allow Apple to create a much slimmer and lighter enclosure for the MacBook Pro. Losing a few millimeters thickness would surely reduce the overall weight. Add the new flat keyboard and a gesture-enabled trackpad and you get some idea as to how Apple could evolve the current design to provide some useful benefits.
Does anybody know about this or have a view?
A total redesign of MBP line will require Apple engineers to look several years ahead, given the length of history since the day of aluminum PowerBook. There maybe an intermediate minor updates such as keyboard, trackpad, possibly new LCD panels that can be housed in the same top cover, perhaps a bit contour on the shape, but not much on overall thickness. A new case redesign that involved thickness for thermal exchange, several components in current MBP need to be considered:
* thickness of super drive (not sure if pro line users are ready for external MBA super drive)
* thickness of DVI connector (moving toward lower profile HDMI or DisplayPort as some other emerging Montevina notebooks)
* thickness of LCD panel (moving toward thinner LED panels)
The redesigned case will need to cope with first generation Nehalem mobile chip (Auburndale, Clarksfield, 35W~45W Q3 2009) until Intel shift to 32nm Westmere (the Nehalem refresh, 25W~35W H1 2010). Thus the case redesign that involve overall thickness may commence around that time. The first Nehalem chip (45nm) will be built with a pair of Penryn cores that led to die size increase for mobile platform, it further suggests thermal challenge on thinner chassis than the current design.
The current MBP design will likely to support two iterations of Montevina refresh and first generation of Nehalem mobile chip.
* DC Intel T9600 Penryn 2.8GHz 1066MHz 6MB 35W (Montevina Update, Q2 2008)
* DC Intel T9800 Penryn 2.93GHz 1066MHz 6MB 35W (Montevina speedbump refresh, Q1 2009)
* QC Intel QX9300 Penryn 2.53GHz 1066MHz 12MB 45W (Montevina refresh BTO, Q1 2009)
* QC Intel Q9100 Penryn 2.26GHz 1066MHz 12MB 45W (Montevina refresh BTO, Q1 2009)
* DC Intel Auburndale 35W~45W (Calpella Update, Q3 2009)
The two QC chips mentioned above are just speculation since there are rumors suggesting that Intel will make one of those chip (Q9100) a 35W part. If the 35W QC chip indeed turn out to be an option, expect QC mobile computing before thinner case redesign take place.








