Apple again rumored to build 'iWatch' components with flexible, space-saving SIP designs
A Tuesday report from Taiwan reiterated previous assertions that Apple would employ a new system-in-package design for the components in its so-called "iWatch," with production said to have begun on the device in time for a launch in the second half of this year.
Source: QPI Group
Apple is believed to have tested system-in-package, or SIP, designs in its WiFi and fingerprint recognition modules before electing to go all-in with the technology, according to the China Times. Taiwanese semiconductor firms Kinsus Interconnect Technology, Nan Ya PCB, and Advanced Semiconductor Engineering are said to have won orders from Apple for component production.
In broad terms, SIP designs integrate many discrete chips into a single package. Unlike SOC designs -- such as Apple's A-series -- the individual pieces of a SIP component can be sourced from different fabs and even be created using different semiconductor technologies. This also allows for the integration of "embedded passives," like RF components, which generally cannot be added to an SOC. The report was first highlighted on Tuesday by G for Games.
By placing components closer together and significantly reducing or eliminating their individual packages, SIP designs can be much smaller and lighter than if designers placed the same components individually on a PCB. They also offer power advantages over non-integrated designs, and can be quicker -- though more expensive -- to manufacture than SOCs.
The report matches up with predictions revealed earlier this month by well-connected analyst Ming-Chi Kuo of KGI Securities. At the time, Kuo said that the iWatch would bring "massive adoption of SIP packaging technology to make the gadget slimmer and lighter."
Rumors of an Apple-branded wearable have circulated for years, picking up significant momentum in 2013. Apple is said to have tasked hundreds of employees with bringing such a product to market, and the company has snapped up industry experts in fashion, wearable devices, and fitness throughout the last 18 months.
The iWatch, if it does see a public release, is thought to carry a wide array of biometric sensors and feature a strong focus on health tracking. Many believe it will function as a stand-alone product, rather than be dependent on a more powerful device as Samsung has done with its Galaxy Gear.
Source: QPI Group
Apple is believed to have tested system-in-package, or SIP, designs in its WiFi and fingerprint recognition modules before electing to go all-in with the technology, according to the China Times. Taiwanese semiconductor firms Kinsus Interconnect Technology, Nan Ya PCB, and Advanced Semiconductor Engineering are said to have won orders from Apple for component production.
In broad terms, SIP designs integrate many discrete chips into a single package. Unlike SOC designs -- such as Apple's A-series -- the individual pieces of a SIP component can be sourced from different fabs and even be created using different semiconductor technologies. This also allows for the integration of "embedded passives," like RF components, which generally cannot be added to an SOC. The report was first highlighted on Tuesday by G for Games.
By placing components closer together and significantly reducing or eliminating their individual packages, SIP designs can be much smaller and lighter than if designers placed the same components individually on a PCB. They also offer power advantages over non-integrated designs, and can be quicker -- though more expensive -- to manufacture than SOCs.
The report matches up with predictions revealed earlier this month by well-connected analyst Ming-Chi Kuo of KGI Securities. At the time, Kuo said that the iWatch would bring "massive adoption of SIP packaging technology to make the gadget slimmer and lighter."
Rumors of an Apple-branded wearable have circulated for years, picking up significant momentum in 2013. Apple is said to have tasked hundreds of employees with bringing such a product to market, and the company has snapped up industry experts in fashion, wearable devices, and fitness throughout the last 18 months.
The iWatch, if it does see a public release, is thought to carry a wide array of biometric sensors and feature a strong focus on health tracking. Many believe it will function as a stand-alone product, rather than be dependent on a more powerful device as Samsung has done with its Galaxy Gear.
Comments
Example: iPhone 5S v Moto X with its complete lack of space optimization in order to save money.
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SIP is the new IGZO, then.
Something tells me Big Bob Mansfield had a role to play in bringing this technology forward. Special Project, indeed!
Is he the one that pushed for the purchase of PA Semi?
Is this really Bob's work? Any pointers please to read?
Is he the one that pushed for the purchase of PA Semi?
Not sure, but as head of Technologies, his work is centered on hardware, especially wireless and semiconductors. I'd find it hard to believe that he didn't at least "bless" the purchase.
Is this really Bob's work? Any pointers please to read?
http://thenextweb.com/apple/2012/10/29/apple-says-its-processor-plans-are-ambitious-puts-mansfield-in-charge-technologies-group/
Is this really Bob's work? Any pointers please to read?
And this:
http://www.bloomberg.com/news/2013-07-29/apple-s-bob-mansfield-shifts-work-to-special-projects.html
It's the cheapest modern smartphone design hat has gotten extensive press. The Galaxy S line is much better by using both sides extensively and has continued to get better with each iteration even though it's not nearly as tightly packed or as small as what Apple brings to the iPhone.
edit: HTC phones look to be on par with Motorola.
This technology is great but it makes design verification and test impossible. Usually when this approach is used it's when the first or second iterations are rock solid before it is cast in stone. It must be verified it works before it's implemented. Chances are this is what has probably taken Apple so long to roll something out. Of course, the market also drives the timeline.
One of the other exclusive licensees is Omega watch.
I guess they'll have to negotiate if they want to use it in watches.
Maybe they will work in collaboration, which would place them into entry level high end.
Looks are deceiving. The Moto X is surprisingly svelte, but quite heavy compared to the iPhone.
Sure, but it has a large footprint. But that's beside the point. If they had spent more money on a more efficient board they could have probably saved some power use and definitely made an even sveltier phone by allowing the battery to take up less space for a given Wattage (less surface area over battery casing) and by reducing the additional PCB substrate.
What will be really interesting is this whole SIP thing. Not that this is new...Apple has been making their own system package designs since the A4. The real issue is that Apple is probably the industry leader in miniaturization and package design. Which means that whatever they design will have a tear-down unlike anything else out there. When you get that kind of specialization, miniaturization, and power savings in one place, it will be a design tough to duplicate.
But not impossible. Samsung could certainly do it if they put their mind to it. And I wouldn't rule out Google now that they have their cache of former-Apple engineers in the Nest deal.