'iPhone 7' may use new 'fan-out' packaging tech to save internal space
Apple is expected to use a new "fan-out" packaging technology for some components to maximize the amount of room in its next-generation iPhone, a Korean report said on Thursday.
Specifically, the technology will be applied to the device's antenna switching module and RF (radio frequency) chip, ETNews suggested. Using fan-out should increase the density of I/O terminals within a package, permitting smaller chip sizes.
Shrinking the chassis of the "iPhone 7" is believed to be a high priority for Apple. On top of minimizing radio components, the company may also be increasing its use of single-chip EMI (electromagnetic interference) shielding, allowing components to sit more closely together.
Indeed, the device may even abandon a 3.5mm headphone jack in the interests of thinness and/or adding a second speaker port. If so, people will have to buy Bluetooth or Lightning accessories for external audio.
The "iPhone 7" and an "iPhone 7 Plus" are expected to ship sometime this fall, probably in September as usual. Features of one or both models could include a dual-lens camera and a more uniform back, without a camera bump or visible antenna bands.
Specifically, the technology will be applied to the device's antenna switching module and RF (radio frequency) chip, ETNews suggested. Using fan-out should increase the density of I/O terminals within a package, permitting smaller chip sizes.
Shrinking the chassis of the "iPhone 7" is believed to be a high priority for Apple. On top of minimizing radio components, the company may also be increasing its use of single-chip EMI (electromagnetic interference) shielding, allowing components to sit more closely together.
Indeed, the device may even abandon a 3.5mm headphone jack in the interests of thinness and/or adding a second speaker port. If so, people will have to buy Bluetooth or Lightning accessories for external audio.
The "iPhone 7" and an "iPhone 7 Plus" are expected to ship sometime this fall, probably in September as usual. Features of one or both models could include a dual-lens camera and a more uniform back, without a camera bump or visible antenna bands.
Comments
Only other way of making it bigger without thickness is having two lens and combining through a DSP;
though you're not getting exactly the same thing as a bigger sensor this way/ There are parallax issues to worry about then.
They can further reduce noise on the sensor to give a big better resolution in low light, but that's a tiny incremental change.
Common or similar concept would be like 3D fab technology you keep hearing like 3D NAND, 3D RAM ( The newest HBM memory being used in AMD Radeon Fuji GPU ), all these are NAND / RAM / circuit layering on top of another.
Fan Out, or TSMC called it InFO is similar, except this is done on a package level and not on a Die level, so integration isn't as "closed". But you still get a lot of the benefits.
I am over simplifying a lot here, but I hope it makes sense to you.
According to TSMC, InFO technology can bring greater than 20% reduction in overall package thickness, a 20% speed gain, and 10% better power dissipation. All these are in additional to 16nm FFC that they are introducing and ramping now, which in it selves provide benefits of cheaper and lower power consumption.
Fan Out tech is something new per se, It has been done and sold many years before. But it may be the first time being incorporated simultaneity with leading node.
Now back to the news, I would call Apple using TSMC 16nm FFC + InFO to be pretty much a Fact for a long time, just as much as 10nm for A11 is also a Fact. All these deal are done and set in stone. The most interesting part here is the Rumor of Antenna switching Module and RF frequency Chip. This implied in a sense Qualcomm's die will be integrated into Apple A10, unless Apple has develop their own RF Chip.
For or a cel phone a wedge would work fine I doubt however that it would do well in a tablet.
New Material, - Likely much better at Radio Reception Signal.
Integrated Radio Frequency Chip - Using TSMC InFo - It is a little over stretch i think Baseband processor would be a better fit, but anyway integration will bring lower power usage.
Larger Battery - As Shown with Leaks
TSMC 16nm FFC - Lower Battery,
All these will point to one iPhone 7 biggest selling point, battery life! Assuming Apple could get 20% energy reduction, and also 10% increase in battery. That is a 40% Increase in battery life!