why g5 pbooks will be easy to make:
dont jump to conclusions: i'm not saying g5 pbooks will be rolling out next week, but i think the architecture will allow for a lot more cooling than people think.
ok, we all know heat rises, and we all also know that the g5 "look" includes grill-like plates with thousands of holes. i think all apple has to do to make these pbooks a reality is move the keyboard and trackpad slighter closer to the front edge (closer to the user), and have a grill-plate with holes up against the edge where the base meets the lcd. place the processor(s ) right there on the edge, and you have natural cooling out the back and the top, in addition to whatever cooling stuff theyre using. if they can add a quiet fan in there, i think they could be cooler than g4 pbooks. maybe i'm crazy, but i think it would work, and it would work fast enough to have pbooks mass produced by the end of summer.
ok, the firing squad may line up now....
ok, we all know heat rises, and we all also know that the g5 "look" includes grill-like plates with thousands of holes. i think all apple has to do to make these pbooks a reality is move the keyboard and trackpad slighter closer to the front edge (closer to the user), and have a grill-plate with holes up against the edge where the base meets the lcd. place the processor(s ) right there on the edge, and you have natural cooling out the back and the top, in addition to whatever cooling stuff theyre using. if they can add a quiet fan in there, i think they could be cooler than g4 pbooks. maybe i'm crazy, but i think it would work, and it would work fast enough to have pbooks mass produced by the end of summer.
ok, the firing squad may line up now....
Comments
I'm after a laptop that doesn't cook me when I'm using it, hence buying Mac. Please don't let Mac laptops join the legion of boiling PC laptops...
Originally posted by ipodandimac
dont jump to conclusions: i'm not saying g5 pbooks will be rolling out next week, but i think the architecture will allow for a lot more cooling than people think.
how profund obe one konobi......what a non-thread if i ever saw one....
this is just as hilarious as the people who ask for a dual processor powermac....
I doubt we will ever have to endure another 5300 fiasco. Apple learned painfully from the PB Hibachi.
ip&imac- I for one am glad to holster my weapon and skip this particular firing squad. There are plenty others that deserve it more. And I agree with you. With new materials, smart increasing of surface area and ventiliation, 90nm chips (underclocked), and the sheer willpower of Grand Master Jobs... I think a PB G5 is very doable. (Besides, Jobs, as we know, has the unique power to declare all the laws of thermodynamics and physics obsolete... there is a switch in his iGulfstream for that)
The one thing I want to understand desparately is why the damn power adapter brick on my PB Ti gets burning hot. The first one melted the wire leading to the computer, and this second one is often too hot to hold. Seems we have some wasted power there. It keeps my coffee warm all morning, though! "The PowerBook G4 with attached hot plate - Caffinate Different."
Apple wants it light (relatively cool) and with decent autonomy. Down clocking a generation of faster chips should cool them significantly, but that will not be cheap because you still have to use the highest rated yields if you want them to switch reliably at lower voltages (where the real heat reductions happen). Also, the current power management from IBM may not be adaquate to the needs of a laptop.
Even so, all this stuff may be roughly where it needs to be for a laptop intro, yeah, you might only get 1.2-1.4 G5s, but perhaps it is doable.
If so, then as I suggested repeatedly when the G5 first broke cover, the real problem might be supply. This is still a new chip coming from a very new facility, and as best we know, it's supposed to be replaced by a newer smaller process version. It could be that so many .13u G5s juat aren't being made yet as both IBM and Apple focus on building product around .09u parts scheduled to appear a bit later.
Originally posted by Matsu
I don't think that heat is the main problem, rather supply and power management. PC makers have been cramming desktop P4s into their machines for a couple of years now -- as hot as any G5, but battery life sucks, and the machines have been heavy.
Apple wants it light (relatively cool) and with decent autonomy. Down clocking a generation of faster chips should cool them significantly, but that will not be cheap because you still have to use the highest rated yields if you want them to switch reliably at lower voltages (where the real heat reductions happen). Also, the current power management from IBM may not be adaquate to the needs of a laptop.
Even so, all this stuff may be roughly where it needs to be for a laptop intro, yeah, you might only get 1.2-1.4 G5s, but perhaps it is doable.
If so, then as I suggested repeatedly when the G5 first broke cover, the real problem might be supply. This is still a new chip coming from a very new facility, and as best we know, it's supposed to be replaced by a newer smaller process version. It could be that so many .13u G5s juat aren't being made yet as both IBM and Apple focus on building product around .09u parts scheduled to appear a bit later.
Good point Matsu.
Speaking of the interest of a g5 in a powerbook the question is, at equal mhz or more precisely at equal watt consumption is a G5 more powerfull than a G4 ?
If not i don't see the interest to have a crippled G5 in a PB, just for marketing reasons.
A 90 nm process G4 new design from IBM should be really performant, an kick the ass of any centrino.
Wouldn't the bus in these Powerbooks also get clocked down? I imagine that this would save quite a bit of power too...
They'll have to use stuff like the cooligy technology, heatpipes and active fans...
Originally posted by G-News
they can't manage the heat by the top surface, as powerbooks have to support closed-lid operation. closing the lid would keep the convection from working and would damage the screen and the computer.
They'll have to use stuff like the cooligy technology, heatpipes and active fans...
good point... i forgot about closed-lid op....
also, in response to the size issues, i point to the xserve....
Originally posted by Powerdoc
A 90 nm process G4 new design from IBM should be really performant, an kick the ass of any centrino.
I don't think this is sufficient, since the G4 is rather weak in FPU operations compared to the centrino. Unless IBM tweaks the FPU too.
I'm wondering if anyone here knows how the 64 bit windows laptops deal with the heat issue? As far as i know, there are a few of those already on the market. I assume they generate alot of heat.
Swerve
Heat DOES NOT rise. Hot air or liquid does.
Croaton
Originally posted by eat@me
how profund obe one konobi......what a non-thread if i ever saw one....
this is just as hilarious as the people who ask for a dual processor powermac....
Obi-Wan Kenobi.
Originally posted by GreatLakes8
Hello folks,
I'm wondering if anyone here knows how the 64 bit windows laptops deal with the heat issue? As far as i know, there are a few of those already on the market. I assume they generate alot of heat.
Swerve
I have not yet heard that AMD had squeezed their chip into anyones laptop yet. Could you provide more information on this?
Originally posted by oldmacfan
I have not yet heard that AMD had squeezed their chip into anyones laptop yet. Could you provide more information on this?
http://www.bestbuy.com/site/olspage....oryId=cat01174
http://news.com.com/2100-1003_3-5141...l?tag=nefd_top
and Alienware I think has a 64 bit notebook also...