Trying to resolve the G5 case question

Jump to First Reply
g-newsg-news
Posted:
in Future Apple Hardware edited January 2014
Here are two quotes I picked up in current threads:



Quote:

The new Dial 1.8 has the 1.6 board...!



4 Gig RAM max and PCI!!



Quote:

Makes me wonder what that g5 picture in that manual was. Very interesting that these powermacs do not resemeble that picture at all.



In fact, they do, to a certain point:

If you look at the pictures of the new PowerMac closely, you'll see that it aparently has a unified heat-sink cover, just like the one that was posted in the manual pictures here.



Look closely, it looks like the dividing line is only etched or cut out, but that the shield is actually one piece.







So my guess is that the model shown in the manual is the Dual 1.8MHz model with only 4 RAM slots. The mainboard probably (likely) constructed anew, since it replaced the old Single 1.6GHz model. So Apple needed a mainboard that was Dual CPU capable, but only had normal PCI and 4 RAM banks. To safe cost, the form factor was probably reduced. I guess this is the system we see.

What remains to be asked is why the fan module was removed for the pictures and why the shown shield did not represent 2 CPUs, but only one.

Might be that the picture shows a model that will never ship in that exact form, as it is a mix of various configurations that were considered.



What do you think?

Comments

  • Reply 1 of 7
    johnqjohnq Posts: 2,763member
    Most of Apple's product shots are hand-optimized for the web, for instance the grill dots are typically faked to be perfect checkerboard patterns whereas were it a photo-to-JPEG or 3D rendering-to-JPEG it would never be perfectly crisp, but rather blurred via anti-aliasing.



    I think that line was hand drawn in the tweaking/optimizing process. (That's not to say I think the line doesn't exist, just that it's enhanced/cleaned up). I typically go down to the pixel level to clean up product shots too, so I know.



    The G5 logos are the same, all horizontal and vertical lines have been made single pixel and a lot of gradients were added over what I assume is a photo.

    Then there is some artifacting over all of this due to final export.



    I would say don't rely on an Apple product shot to be 100% real at that pixel level. it is very often highly tweaked to look its absolute best (which I love about their sites - attention to detail).
     0Likes 0Dislikes 0Informatives
  • Reply 2 of 7
    clonenodeclonenode Posts: 392member
    The Service Manual photo showed a heat sink cover that had a SINGLE G5 logo on it. It was also smaller than the the current dual G5 cover... separating rule or not. At least that's how I remember it... can't seem to find it any more.
     0Likes 0Dislikes 0Informatives
  • Reply 3 of 7
    rhumgodrhumgod Posts: 1,289member
    It's right here.
     0Likes 0Dislikes 0Informatives
  • Reply 4 of 7
    clonenodeclonenode Posts: 392member
    Quote:

    Originally posted by Rhumgod

    It's right here.



    Okay, great! Thanks! So, it's not smaller, but there is only ONE G5 logo. Different than the new releases.
     0Likes 0Dislikes 0Informatives
  • Reply 5 of 7
    mr. memr. me Posts: 3,221member
    Quote:

    Originally posted by clonenode

    Okay, great! Thanks! So, it's not smaller, but there is only ONE G5 logo. Different than the new releases.



    Since the famous leaked photos of the MDD G4, my theory is that Apple makes available plausible fake photos of upcoming hardware. Remember the faked G5 that looked like a dehumidifier? If the Fruit Company makes available several different fakes, then it can trace them back to the source after they get leaked to rumor sites. It will be interesting to see what the new monitors really look like.
     0Likes 0Dislikes 0Informatives
  • Reply 6 of 7
    tommy16tommy16 Posts: 8member
    The large single heat sink could be hiding the SMC or CMC version of the Power5 chip from IBM. It may have been only an internal prototype at Apple or it may be something intended for down the road for consumers. As these chips are quite expensive they may wait for better sales and reduced size before bringing it to market. From the size of the ceramic the chip is shown on at the IBM site it appears exactly the size of the single heatsink shown in the photo that Apple had pulled. Since there is little to make OSX run on this chip for Apple I would bet that they intend to use it in the future. Enterprise is one of the areas they plan on being big in. Even if the units are multiples of price to standard Apple hardware there is money to be made. IBM is getting rave reviews about the chip and touting it as the future of computing.



    http://www.13pc.com/art/200310/1287.htm



    People keep trying to shut me down on this idea but we have just seen that the newest G5 availabe do not match the photo that was removed. Apple just got into the supercomputer market by accident. They didn't even believe it was a real order when Virginia Tech called to place the order. I am telling you that this is a genuine possibility. It may not be the general consumer model they will offer but you can bet it will be available.



     0Likes 0Dislikes 0Informatives
  • Reply 7 of 7
    g-newsg-news Posts: 1,107member
    The first of you guys who gets a new Dual 1.8GHz please post pictures ASAP.

    I still think only the logos on the unified heat-sink shield have changed.
     0Likes 0Dislikes 0Informatives
Sign In or Register to comment.