Pictures of alleged 'iPhone 8' OLED screen, motherboard escape supply chain
A new pair of parts reportedly from the "iPhone 8" have surfaced, with one of them a single layer of the device's L-shaped motherboard, and the other what is claimed to be the edge-to-edge OLED screen for the phone.
A picture of the board was posted by Benjamin Geskin on Twitter on Sunday. It allegedly depicts one of the two layer of the "iPhone 8" motherboard, seemingly confirming reports from as early as November 2016 claiming that the device would have the stacked board.
No chips are in place on the board.
Also shown on Sunday is what is said to be the screen assembly for the device. Reportedly, screen assemblies are being sold for over $5000 on the Chinese black market.
There is no way to authenticate either part.
The "iPhone 8" is rumored to feature an edge-to-edge OLED panel with a 5.1-inch user space with the remainder dedicated to virtual buttons. Also expected is a new 3D facial scanner, possibly supplanting Touch ID.
A picture of the board was posted by Benjamin Geskin on Twitter on Sunday. It allegedly depicts one of the two layer of the "iPhone 8" motherboard, seemingly confirming reports from as early as November 2016 claiming that the device would have the stacked board.
No chips are in place on the board.
#iPhone8 PCB
(One of the 2 layers) pic.twitter.com/VAYhzQnMuS-- Benjamin Geskin (@VenyaGeskin1)
Also shown on Sunday is what is said to be the screen assembly for the device. Reportedly, screen assemblies are being sold for over $5000 on the Chinese black market.
#iPhone8 Displays
At the moment, the price of these displays is US$5000 on the Chinese black market.
(via https://t.co/5NIfQH97FV) pic.twitter.com/zFMSWsyPAR-- Benjamin Geskin (@VenyaGeskin1)
There is no way to authenticate either part.
The "iPhone 8" is rumored to feature an edge-to-edge OLED panel with a 5.1-inch user space with the remainder dedicated to virtual buttons. Also expected is a new 3D facial scanner, possibly supplanting Touch ID.
Comments
7s still represents upgrade on Cariers that don't support eSim but it would make it clear they are holding back better options from happening.
- the motherboard is way to big for an iPhone
- the area for the SoC is to small for an A11
- the areas for discrete components are gigantic
This is an old board.
It is board 1 of 2 that are apparently stacked so perhaps the A-series chip takes up more of the surface area on the other chip.
This looks like the PCB for the SoC and NAND.
So the motherboard shown here is much smaller than I first thought.