<strong>so, any photoshop wizards up to the task of virtualy taking off the plastic rap and trying to get it to look like it might with it off?
</strong><hr></blockquote>
Kinda like a real trashy takeoff on the dancing iMac, we could have Saran wrapped new G4 dancing on stage and Macnuts crowding close waving bills in the air and yelling "Take it off!" It starts to strut and peel....
[quote]Originally posted by GardenOfEarthlyDelights:
<strong>When I saw the photos I thought aloud, ...why the new layout? Then I saw the reason...it?s ?cause of the weight, the seven-pound heatsink. Putting it low makes the case more stable, although I don?t know how they?d route the cables.
So why do they need such a big chunk of steel?</strong><hr></blockquote>
I've been thinking abotu this heatsink, and I just don't see it.
First off, a seven-pound heatsink of (even remotely) typical design would be massive enough to cause structural problems. It's great stuff, but it's NOT meant to bear that kind of weight!
Second off, heat sinks would most likely be aluminum: it's extremely lightweight, low-mass, and a highly efficient heat conductor; it would therefore be far preferable to steel or iron, which are renowned for holding heat (not a desirable property in a heatsink!).
If we want to take seriously the notion of a 7# heatsink, however, we have to (*ahem*) 'think different'.
So let's assume that the pics & the PDF are information. What do we know?
PDF sez "Turbo cooling", 4 front airvents placed low, a side-blowing fan, "triple layer side panel, for ventilation", "4" variable speed turbine fan".
PDF shows an area devoted to a "very large" 7-lb heat sink.
PDF also shows the back panel filled w/ holes, apparently covering an inner panel filled with smaller holes.
Photo #3 shows us a heavily ventilated interior. I've never seen the insides of a powermac before, so I don't know if this is typical or not, but this is a well-machined piece of equipment. The metal of the casing doesn't seem to be the same sort of metal I've usually seen in PC casings, and it seems shinier, or cleaner-looking. My guess is structural (aircraft) aluminum.
The fan is front-amidships, on the drop-down side IIRIR. I can't tell by looking if it would blow air into of out of the central cavity. My guess is, it blows out.
So: efforts have obviously been made to maximize airflow through the case; the fan is alleged (and seems) to be porting into a hollow section within that sie of the case. This would seem to make the case a active player in the ventilation process, so why not make the case itself a heat-sink? Seven pounds of structural-density aluminum ought to make a double-walled 'hull' that is strong & rigid despite all the perforations; actively ventilate it along at least one large, flat face, & you can disperse a lot of heat that way. Seems possible that the "very big" heat-sink is secondary, a scavenger, with the main dissipation via direct connection to the metal of the outer wall, and from there to the frame at large, with a layer of forced air continually bathing the largest-area surface in the machine, and exhausting out that double-screen-door of a back panel.
As for that "turbine fan", it's probably just kicked on-&-off by changed in airflow.
What speed FireWire (Although the FireWire ports look like the 400Mbps kind -- the 800Mbps kind reportedly use a different plug. No new FireWire?)</strong><hr></blockquote>
ATA-100 would be a pretty safe bet. Virtually all the HD manufacturers plan to skip over ATA-133 and just go to Serial ATA. I would expect Apple shall do the same. I would like to see serial ATA included on the next motherboard though I don't expect it sadly.
Max RAM is a safe bet at 4GB (or 3GB if they retain only 3 RAM slots).
AGP one would have to expect is AGP 8x considering ATI has announced they are bringing an AGP 8x card to the Mac late August. It would be downright stupid not to fully support it.
PCI should be at 66MHz. There have already been a couple references to this.
Firewire 2 will be included in the final product. Trust me on that one. Apple wants to be first out the door with it and it is quite possibly yet another reason Apple has held off in announcing towers until August.
There could be some seriously hot chips in the next PowerMac... first of all they could be pushing the (new?) G4's clock rate to the bleeding edge, second the chipset could become a real monster if it starts including some kinds of computational units, and third the new 100+ million transistor GPUs from ATI and nVidia are really hot. If they are designing for the future and anticipating an upcoming G5 then they may overengineer the cooling system.
I've been thinking abotu this heatsink, and I just don't see it.
First off, a seven-pound heatsink of (even remotely) typical design would be massive enough to cause structural problems. It's great stuff, but it's NOT meant to bear that kind of weight!
</strong><hr></blockquote>
Totally Agree.
Regardless of how accurate any of the other information is one thing is for sure:
The heat sink/cooling system does not weigh 7 lbs
The is almost as much as a gallon of water or milk; 3.5 liters for those the metric system. Not a chance in hell it would weight that much.
Largely I still maintain there is little functionality to the developers (meaning not the final version) case other than to provide for airflow.
As the heat if the internals increases, as should expected it G$ goes to .13 and 1.4Ghz, there needs to be more general cooling as opposed to solely processor direct.
The current QS design provides no room for 'positive air flow.' It has only the Power Supply and a side blowing fan.
Maximum efficiency cooling would be achieved by a pass through pattern. Meaning air in the front and exhausted out the back. Solution: Drill Holes.
Anyhow, even if this was exactly the was it was gonna look there isn't a chance the cooling sys would be that heavy.
[quote]The heat sink/cooling system does not weigh 7 lbs
The is almost as much as a gallon of water or milk; 3.5 liters for those the metric system. Not a chance in hell it would weight that much.<hr></blockquote>
Now, admittedly I have no idea what I'm doing, so these numbers could be way off. I saw someplace else that the heatsink is purportedly enormous, 7 inches by 6 inches by 7 inches. That's 294 cubic inches. I looked up the density for some random aluminum alloy, and it was .0975 lb/cubic inch. Using the power of arithmetic, I get a weight of 28 some-odd pounds. Now of course the heatsink isnt a solid block, that would be silly. But I could certainly see how a heatsink of those proportions made from aluminum would come in at 7 pounds.
Info posted on macrumors.com, that apparently comes from the author of the PDF.
[quote] the heatsink is a very large aluminum straight finned squared design. about 6" x 7" x 6" approx and weighs about 7 lbs; it is attatched to the MLB by 3 screws, but not like XSERVE; 2 screws are on countersunk standoffs that go through the MPU, and one that attatches to the back panel on a ridge above the modem port. The MPU itself is held down only by the weight of the heatsink, and a 'flex' bar, that is a plastic bar with 2 metal springloaded clips that allow it to flex freely. <hr></blockquote>
I suppose the flexbar arrangement answers the concerns in this thread about a 7lb heatsink crushing the processor when the computer is jarred.
Comments
<strong>if you cant get better chips... just multiply them! <img src="graemlins/smokin.gif" border="0" alt="[Chilling]" /> </strong><hr></blockquote>
This is what I see for the near future, the complete powermac line having dual (or more) G4s.
I agree that this will be about 80% of what we'll see released next. Why the same style case???....because it'll still house G4s.
That's what I think at least.
<strong>so, any photoshop wizards up to the task of virtualy taking off the plastic rap and trying to get it to look like it might with it off?
</strong><hr></blockquote>
Kinda like a real trashy takeoff on the dancing iMac, we could have Saran wrapped new G4 dancing on stage and Macnuts crowding close waving bills in the air and yelling "Take it off!" It starts to strut and peel....
<strong>When I saw the photos I thought aloud, ...why the new layout? Then I saw the reason...it?s ?cause of the weight, the seven-pound heatsink. Putting it low makes the case more stable, although I don?t know how they?d route the cables.
So why do they need such a big chunk of steel?</strong><hr></blockquote>
I've been thinking abotu this heatsink, and I just don't see it.
First off, a seven-pound heatsink of (even remotely) typical design would be massive enough to cause structural problems. It's great stuff, but it's NOT meant to bear that kind of weight!
Second off, heat sinks would most likely be aluminum: it's extremely lightweight, low-mass, and a highly efficient heat conductor; it would therefore be far preferable to steel or iron, which are renowned for holding heat (not a desirable property in a heatsink!).
If we want to take seriously the notion of a 7# heatsink, however, we have to (*ahem*) 'think different'.
So let's assume that the pics & the PDF are information. What do we know?
PDF sez "Turbo cooling", 4 front airvents placed low, a side-blowing fan, "triple layer side panel, for ventilation", "4" variable speed turbine fan".
PDF shows an area devoted to a "very large" 7-lb heat sink.
PDF also shows the back panel filled w/ holes, apparently covering an inner panel filled with smaller holes.
Photo #3 shows us a heavily ventilated interior. I've never seen the insides of a powermac before, so I don't know if this is typical or not, but this is a well-machined piece of equipment. The metal of the casing doesn't seem to be the same sort of metal I've usually seen in PC casings, and it seems shinier, or cleaner-looking. My guess is structural (aircraft) aluminum.
The fan is front-amidships, on the drop-down side IIRIR. I can't tell by looking if it would blow air into of out of the central cavity. My guess is, it blows out.
So: efforts have obviously been made to maximize airflow through the case; the fan is alleged (and seems) to be porting into a hollow section within that sie of the case. This would seem to make the case a active player in the ventilation process, so why not make the case itself a heat-sink? Seven pounds of structural-density aluminum ought to make a double-walled 'hull' that is strong & rigid despite all the perforations; actively ventilate it along at least one large, flat face, & you can disperse a lot of heat that way. Seems possible that the "very big" heat-sink is secondary, a scavenger, with the main dissipation via direct connection to the metal of the outer wall, and from there to the frame at large, with a layer of forced air continually bathing the largest-area surface in the machine, and exhausting out that double-screen-door of a back panel.
As for that "turbine fan", it's probably just kicked on-&-off by changed in airflow.
Thoughts, please!
anybody got any singles?
<strong>What ATA?
What max RAM?
What speed AGP?
What speed PCI?
What speed FireWire (Although the FireWire ports look like the 400Mbps kind -- the 800Mbps kind reportedly use a different plug. No new FireWire?)</strong><hr></blockquote>
ATA-100 would be a pretty safe bet. Virtually all the HD manufacturers plan to skip over ATA-133 and just go to Serial ATA. I would expect Apple shall do the same. I would like to see serial ATA included on the next motherboard though I don't expect it sadly.
Max RAM is a safe bet at 4GB (or 3GB if they retain only 3 RAM slots).
AGP one would have to expect is AGP 8x considering ATI has announced they are bringing an AGP 8x card to the Mac late August. It would be downright stupid not to fully support it.
PCI should be at 66MHz. There have already been a couple references to this.
Firewire 2 will be included in the final product. Trust me on that one. Apple wants to be first out the door with it and it is quite possibly yet another reason Apple has held off in announcing towers until August.
[ 07-21-2002: Message edited by: Telomar ]</p>
<strong>
Max RAM is a safe bet at 4GB (or 3GB if they retain only 3 RAM slots).
</strong><hr></blockquote>
The XServe is limited to 2 Gig on 4 slots, it could be different, but I suspect 2 Gig will be the limit
<strong>
I've been thinking abotu this heatsink, and I just don't see it.
First off, a seven-pound heatsink of (even remotely) typical design would be massive enough to cause structural problems. It's great stuff, but it's NOT meant to bear that kind of weight!
</strong><hr></blockquote>
Totally Agree.
Regardless of how accurate any of the other information is one thing is for sure:
The heat sink/cooling system does not weigh 7 lbs
The is almost as much as a gallon of water or milk; 3.5 liters for those the metric system. Not a chance in hell it would weight that much.
Largely I still maintain there is little functionality to the developers (meaning not the final version) case other than to provide for airflow.
As the heat if the internals increases, as should expected it G$ goes to .13 and 1.4Ghz, there needs to be more general cooling as opposed to solely processor direct.
The current QS design provides no room for 'positive air flow.' It has only the Power Supply and a side blowing fan.
Maximum efficiency cooling would be achieved by a pass through pattern. Meaning air in the front and exhausted out the back. Solution: Drill Holes.
Anyhow, even if this was exactly the was it was gonna look there isn't a chance the cooling sys would be that heavy.
j/k
The is almost as much as a gallon of water or milk; 3.5 liters for those the metric system. Not a chance in hell it would weight that much.<hr></blockquote>
Now, admittedly I have no idea what I'm doing, so these numbers could be way off. I saw someplace else that the heatsink is purportedly enormous, 7 inches by 6 inches by 7 inches. That's 294 cubic inches. I looked up the density for some random aluminum alloy, and it was .0975 lb/cubic inch. Using the power of arithmetic, I get a weight of 28 some-odd pounds. Now of course the heatsink isnt a solid block, that would be silly. But I could certainly see how a heatsink of those proportions made from aluminum would come in at 7 pounds.
[quote] the heatsink is a very large aluminum straight finned squared design. about 6" x 7" x 6" approx and weighs about 7 lbs; it is attatched to the MLB by 3 screws, but not like XSERVE; 2 screws are on countersunk standoffs that go through the MPU, and one that attatches to the back panel on a ridge above the modem port. The MPU itself is held down only by the weight of the heatsink, and a 'flex' bar, that is a plastic bar with 2 metal springloaded clips that allow it to flex freely. <hr></blockquote>
I suppose the flexbar arrangement answers the concerns in this thread about a 7lb heatsink crushing the processor when the computer is jarred.
<strong>Well, macrumors now claims to have received a takedown notice from Apple Legal....</strong><hr></blockquote>
same now with <a href="http://www.macbidouille.com"; target="_blank">www.macbidouille.com</a>
<strong>
same now with <a href="http://www.macbidouille.com"; target="_blank">www.macbidouille.com</a></strong><hr></blockquote>
And according to the MacRumors boards, spymac got one too....
i've now learned how to say "removed at the request of apple legal" in french.
damn bastards must be up all night.
edit: lol, nevermind, this thread is older than i thought. guess i must not be paying enough attention on the weekends.
[ 07-22-2002: Message edited by: alcimedes ]</p>