iPhone 16 to use graphene heat sink to solve overheating issues
Users complained of overheating iPhone 15 models shortly after release, which Apple fixed via software, but the iPhone 16 is rumored to have a hardware solution, too.
iPhone 15 Pro had an overheating problem
Select iPhone 15 and iPhone 15 Pro models could overheat to the point of being uncomfortable to hold, at least until iOS 17.0.3. Apple blamed these conditions on poorly optimized software and issued a software fix, but more effective cooling may also help.
The iPhone 15 is already here and can't get a hardware change mid-cycle, but X user @KosutamiSan says Apple is working on a solution for iPhone 16. The company could switch to a graphene heat sink and a metal battery case to promote better heat transfer.
The iPhone is such a tiny object that there isn't much space for anything, especially thick or heavy heat sinks. Graphene is an excellent material for a heat sink because it has ten times more thermal conductivity than copper.
The iPhone has no fan, so heat has to be dissipated through the device frame into the air using passive heat transfer. Heat sinks do precisely what the name implies, they remove heat from undesirable areas by having a more efficient thermal conduction value than the materials around it.
Graphene would perform better than the existing cooling mechanism, thus allowing the iPhone to deal with more heat more efficiently.
Apple is actively working on graphene thermal system of iPhone 16 Series to solve the heating problem existing before. And the battery of Pro series would change to metal shell, for the same reason.
-- Kosutami (@KosutamiSan)
Apple has investigated many ways to cool the iPhone down but hasn't changed much beyond using different heat sinks. Ming-Chi Kuo suggested Apple could use vapor chambers at one point, while a patent pointed to magnets as a solution.
However, those options are cost-prohibitive and require radical design changes. Graphene may be the perfect solution to keep the iPhone 16 from overheating if the rumor proves true.
Kosutami is a known leaker that collects design validation test products and other such pre-production items. The leaker has a short history with accurate leaks like USB-C components for iPhone 15, but also some misses like with a supposed iPhone 15 Pro Thunderbolt cable. So, we're rating this leak as possible.
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Comments
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I suspect the ideal solution would be the screen. It has a large surface area and there is rarely anything more than an ultra-thin screen protector and when in use is usually exposed to air. Perhaps DOW (or whoever Apple uses) can develop a super tough glass screen which also has high thermal conductivity.
Air vents would prevent the phone from having an IP rating. Vents are also only valuable until they get clogged with debris (lint, dust, et al.) or blocked by a case.
Having a large metal body is great but, as previously mentioned, becomes far less effective when the phone is installed in a case. While the case could be manufactured using thermally conductive materials, you would still have significant loss at the point of contact between the phone and the case.
Efficiency of the CPU and software would certainly help, but most people who write software these days pay little attention to code efficiency. Why bother when there always seem to be more resources available (memory & cpu cycles).
For handhelds like a phone, the big turtle is your hand, and the phone can’t get too hot for your skin. So, that ultimately limits how many Watts the SoC can consume, which is going to be able 4 to 5 Watts sustained.
A more robust / less fragile iPhone would be very welcome indeed
I have designed a number of high power units where a fair bit of power needed to be removed from a sealed unit operating in a high temperature environment. There are a number of factors to consider, but in the end it all boils down to how much heat you can remove from the device per unit of time.
An insulating case may decrease the time to get to a point of shutting down the phone, yes, but I don't think that is Apple's design condition at all. The design condition is going to be something like 95 °F ambient temperature at 10,000 ft altitude or something like that. Everything else will be an edge case. Like you won't be doing any long running high power consumption ops at 110 °F ambient or when exposed to high temps in the sun. The phone is just going to shut down or not run.
This rumor is strange, or the interpretation of the data from the rumor is strange. A metal encased battery is not new to Apple. They have been using them in Apple Watches for a few years now. This may be that they finally have production of metal encased batteries to the point that a large one can be built at the price targets for a phone. The metal encased batteries may be just more robust, easier to replace, safer to service, have better structural performance, etc. Better thermal conductivity? They could just use thermal paste and graphene on pouch batteries.
The graphene? I thought they are already using it in iPhones? If there is more extensive use, it will be to spread the heat across as much of the surface area of the iPhone as possible. I don't think changes how many Watts they'll let the SoC consume. It will be the same combinations of glass and metal. It's surface temperatures will be about the same. It has to dissipate 4 to 5 Watts.
Use of the vapor chambers (Kuo rumormongering) is really for transfer heat right off the lid of the SoC package, where it is more efficient with concentrated heat sources. It won't do anything about device touch temperatures. It's all the same 4 to 5 Watts sustained that needs to be removed. If Apple wants to have 8, 9, 10 Watts per core, they might use them. Maybe at 2nm? But there will be thermal transistors to spread heat at the silicon level sooner or later.
Full list of tricks to steal from the dead Razer Phone
- vapour chamber cooling
- WQHD screen (1440 pixels wide, not stupidly tall like sonys that stick out of pockets)
- higher quality bluetooth like LDAC or AptX Adaptive
Those would make me switch back… some year…