Now one thing puzzles me, if the processor is so stinking hot that they have to redo the cooling system and they're going with a dramatic reshuffle of the internal arrangement why not put the processor (the hottest component) at the top so they can take advantage of the chimmney effect (the air being heated at the top rises and lowers the air pressure in the case and draws in cool air at the bottom). I mean they've been doing fanless solutions for a while, it seems like they'd be doing something a bit more sophisticated than the PCish mega heat sink msking up for so-so airflow.
[quote]Originally posted by Yet Another Registration:
<strong>Maybe the reason why the pictures are so bad as to look fake is that they guy who took them had about 4.2 seconds before he was caught.
He snapped a few quickies before anyone was looking,m and then bolted.
</strong><hr></blockquote>
Stands to reason if we only had the external shots, but whoever did it had time to shoot the interior, pull the proc card and shoot it w/o the heat sink. I mean he could have snuck in a couple times over a few day period I guess and shot it as the engineers were at different stages of evaluation, but what 3rd party outfit Apple'd be dealing with would need to yank the proc card from the machine?
The PCB and the electronics are MUCH harder, if not almost impossible, to fake.
The case is almost surely a test bed, much like the spy photos you see of cars in the Auto mags before production.
Every new 'hoax' we see is always a case only picture. This is highly elaborate and well beyond the abilities of a Simple PhotoChop.
At the very least it is hardware parts specifically crafted to match the 'red board' and photographed.
Prediction: the new logic board will have this shape and and layout. The new case will have this metal door. Other than that similarities to these photos will be few.
<strong>Now one thing puzzles me, if the processor is so stinking hot that they have to redo the cooling system and they're going with a dramatic reshuffle of the internal arrangement why not put the processor (the hottest component) at the top so they can take advantage of the chimmney effect (the air being heated at the top rises and lowers the air pressure in the case and draws in cool air at the bottom). I mean they've been doing fanless solutions for a while, it seems like they'd be doing something a bit more sophisticated than the PCish mega heat sink msking up for so-so airflow.</strong><hr></blockquote>
Hehe. Maybe it's gotta be somewhat hot to work properly, just not melting.
...the reason the tape is all over it is because it a new puter straight out of the box, most likely. If you have ever unpacked a new G4 that plastic is covered with protective plastic on all parts. But those are defintiely the same handles as the ones on the QS sittin right here in front of me.
And the reason I think its a new puter is because, most likely is was supposed to ship at MWNY, but either sales were too slow to clear out the old models, or there is a shortage of chips to fill orders. More than likely, its a channel inventory problem. So, could be this photo comes from a dude in a warehouse somewhere.
As for the front panel everyone is asking about, I'd say it has to do with plastic quality issues. Anyone who has a QSG4 knows what I'm talking about. The QS forms little flow lines around and between the front panel drive bay doors. I'm sure this is to reduce or prevent these unsightly blemishes.. Its easier to mold the plastic around a large opening like this than two small openings like on the current QS.
But, its definitely a real and different case on the inside. And as for SDRAM, DDR RAM is SDRAM.
Also, the speaker is defintely a different design than on the current QS. It looks more flush than the deeply setback one on my QS.
Oh, and to those wondering about vertical HDs, anyone who has owned a Cube knows that Apple has shipped vertically mounted HDs before.
No doubt, this is the exact same board that appeared on eBay a while back. And, it will be nice to have hardware RAID on board, if that chip set supports it (which I would think it would, why else put 2 IDE ports for HDs).
All in all, I'm excited to see this case. Still has the great easy open design of the current design, but throws in DDR, dual IDE, and 2 5.25 external drive bays. Very nice, very nice.
BTW, the front panel may be polished, Apple is moving in that polished chrome direction with the iPod, iMac, etc.
Stands to reason if we only had the external shots, but whoever did it had time to shoot the interior, pull the proc card and shoot it w/o the heat sink. I mean he could have snuck in a couple times over a few day period I guess and shot it as the engineers were at different stages of evaluation, but what 3rd party outfit Apple'd be dealing with would need to yank the proc card from the machine?</strong><hr></blockquote>
Unless they've been testing a new mobo with older CPU for a while, and Apple just FedExed them a new daughtercard and heatsink.
I think the 1gb sticks made by infineon are quite expensive, about the price of a eMac last time I heared. If I had the chance to buy a powermac I'd go with 2x512 now and again 2x512 a few months later.
Geez, if I think that my first computer had 2 mb of ram and around 20 mb of hard disk... sheesh!</strong><hr></blockquote>
I know what you mean, my first had 64k, and that was WITH a $300 extra memory card. I keep remembering that "640k is enough for anyone" comment......
Anyone have the leaked Quicksilver pics still? If so post em. We all thought those were fake and photoshopped.
By the way...how long till Dorsal shoves his head in here saying that he has been testing these machines?!? <img src="graemlins/oyvey.gif" border="0" alt="[No]" />
Comments
He snapped a few quickies before anyone was looking,m and then bolted.
That's my theory.
And I think some of you will NEVER be satisfied.
Sheesh. DDR, full drive bays, faster proc (large heat sink), lots of RAM, and you are still saying it's not enough?
What more do you need?
ting5
<strong>Maybe the reason why the pictures are so bad as to look fake is that they guy who took them had about 4.2 seconds before he was caught.
He snapped a few quickies before anyone was looking,m and then bolted.
</strong><hr></blockquote>
Stands to reason if we only had the external shots, but whoever did it had time to shoot the interior, pull the proc card and shoot it w/o the heat sink. I mean he could have snuck in a couple times over a few day period I guess and shot it as the engineers were at different stages of evaluation, but what 3rd party outfit Apple'd be dealing with would need to yank the proc card from the machine?
<strong>Maybe the reason why the pictures are so bad as to look fake is that they guy who took them had about 4.2 seconds before he was caught.
He snapped a few quickies before anyone was looking,m and then bolted.
That's my theory.
And I think some of you will NEVER be satisfied.
Sheesh. DDR, full drive bays, faster proc (large heat sink), lots of RAM, and you are still saying it's not enough?
What more do you need?
ting5</strong><hr></blockquote>
"What more do you need?"
A PM release in mid-August
The PCB and the electronics are MUCH harder, if not almost impossible, to fake.
The case is almost surely a test bed, much like the spy photos you see of cars in the Auto mags before production.
Every new 'hoax' we see is always a case only picture. This is highly elaborate and well beyond the abilities of a Simple PhotoChop.
At the very least it is hardware parts specifically crafted to match the 'red board' and photographed.
Prediction: the new logic board will have this shape and and layout. The new case will have this metal door. Other than that similarities to these photos will be few.
<strong>
Looks better at only 390 height.
[ 07-21-2002: Message edited by: G-News ]</strong><hr></blockquote>
Which one is it do you think? BRING BACK THE G4 Cube.
I was actually hoping for the G4 Sphere
EDIT: Hey, i was the last on this page. I was the first and last on this page <img src="graemlins/smokin.gif" border="0" alt="[Chilling]" />
[ 07-21-2002: Message edited by: Nebagakid ]</p>
<strong>Now one thing puzzles me, if the processor is so stinking hot that they have to redo the cooling system and they're going with a dramatic reshuffle of the internal arrangement why not put the processor (the hottest component) at the top so they can take advantage of the chimmney effect (the air being heated at the top rises and lowers the air pressure in the case and draws in cool air at the bottom). I mean they've been doing fanless solutions for a while, it seems like they'd be doing something a bit more sophisticated than the PCish mega heat sink msking up for so-so airflow.</strong><hr></blockquote>
Hehe. Maybe it's gotta be somewhat hot to work properly, just not melting.
<strong>
Why not a french site ?
What a dumb post !</strong><hr></blockquote>
I was just saying that if the person works in Cupertino, why would they choose a site based out of France. It wasn't anyhting against France.
...the reason the tape is all over it is because it a new puter straight out of the box, most likely. If you have ever unpacked a new G4 that plastic is covered with protective plastic on all parts. But those are defintiely the same handles as the ones on the QS sittin right here in front of me.
And the reason I think its a new puter is because, most likely is was supposed to ship at MWNY, but either sales were too slow to clear out the old models, or there is a shortage of chips to fill orders. More than likely, its a channel inventory problem. So, could be this photo comes from a dude in a warehouse somewhere.
As for the front panel everyone is asking about, I'd say it has to do with plastic quality issues. Anyone who has a QSG4 knows what I'm talking about. The QS forms little flow lines around and between the front panel drive bay doors. I'm sure this is to reduce or prevent these unsightly blemishes.. Its easier to mold the plastic around a large opening like this than two small openings like on the current QS.
But, its definitely a real and different case on the inside. And as for SDRAM, DDR RAM is SDRAM.
Also, the speaker is defintely a different design than on the current QS. It looks more flush than the deeply setback one on my QS.
Oh, and to those wondering about vertical HDs, anyone who has owned a Cube knows that Apple has shipped vertically mounted HDs before.
No doubt, this is the exact same board that appeared on eBay a while back. And, it will be nice to have hardware RAID on board, if that chip set supports it (which I would think it would, why else put 2 IDE ports for HDs).
All in all, I'm excited to see this case. Still has the great easy open design of the current design, but throws in DDR, dual IDE, and 2 5.25 external drive bays. Very nice, very nice.
BTW, the front panel may be polished, Apple is moving in that polished chrome direction with the iPod, iMac, etc.
I guess we'll know for sure August 13th?
<strong>well, they are down, so either the site is looking to fool us, or they were real</strong><hr></blockquote>
or they got an email from your source: "You guys are such goobers..." or words to that effect
<strong>
Stands to reason if we only had the external shots, but whoever did it had time to shoot the interior, pull the proc card and shoot it w/o the heat sink. I mean he could have snuck in a couple times over a few day period I guess and shot it as the engineers were at different stages of evaluation, but what 3rd party outfit Apple'd be dealing with would need to yank the proc card from the machine?</strong><hr></blockquote>
Unless they've been testing a new mobo with older CPU for a while, and Apple just FedExed them a new daughtercard and heatsink.
<strong>
I think the 1gb sticks made by infineon are quite expensive, about the price of a eMac last time I heared. If I had the chance to buy a powermac I'd go with 2x512 now and again 2x512 a few months later.
Geez, if I think that my first computer had 2 mb of ram and around 20 mb of hard disk... sheesh!</strong><hr></blockquote>
I know what you mean, my first had 64k, and that was WITH a $300 extra memory card. I keep remembering that "640k is enough for anyone" comment......
By the way...how long till Dorsal shoves his head in here saying that he has been testing these machines?!? <img src="graemlins/oyvey.gif" border="0" alt="[No]" />
<strong>Dang, somehow I missed the pics (and now can only see the remenants.
They are still here:
<a href="http://www.macbidouille.com/niouzcontenu.php?date=2002-07-21#3087"; target="_blank">http://www.macbidouille.com/niouzcontenu.php?date=2002-07-21#3087</a>;
They just changed the image names.
[ 07-21-2002: Message edited by: JLL ]</p>
--Apple PowerMac G4 (& G5 Concept)--
you can copy and paste to check it out...
4.49 EDT!