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TSMC's Arizona chip plant nears Apple approval, but will never rival Taiwan
mikethemartian said:It seems that fabs more focused on the type of research and development that universities do is more fitting for the US than mass production.One of the reasons TSMC built this facility in Arizona is because Intel has been operating there for about 40 years. They have an existing and local skills base, training and supply chain.Since TSMC N5/N4 is different and more advanced than Intel 7nm to 14nm, everyone still needs to be trained, and TSMC still has to have Taiwanese engineers come over to get the fab working.This will be true for all foreign manufacturing plants. If you want it to get up and running fast, you aren’t doing it with people who have never done it before. You are doing it with people who have several cycles under their belt. Batteries, solar PV, anything.It’s not assembly line workers. It’s the manufacturing engineers and the supply chain for the plants. -
What speed to expect from M4 Ultra in the 2025 Mac Studio & Mac Pro
9secondkox2 said:blastdoor said:netrox said:I don't think a monolithic die makes sense. I am pretty sure they will be doing chiplet designs which makes economic sense and can offer impressive performance on some tasks.
I hope we get an M4 ultra but I’m also starting to think I shouldn’t count on it. I really like the idea of having an M4 ultra Mac Studio sitting on my desk but having a pair of M4 pro minis could also serve my purpose. If Apple would update the whole lineup at the same time I could pick the best computer, but with a huge delay for the ultra — and not even knowing if it will appear at all — the ultra becomes a harder option to chooseApple can level the playing field and come out on top of literally every player with a monolithic die. The potential of the Mac Pro is seriously wasted currently. The equivalent of combining two ultra monoliths would hurt some serious feelings. The only barrier would be apathy on the part of apple.The standard Mx model is about 100 mm2. Then, you can roughly double for Pro, and double the Pro to get to the Max.So, a Mx Pro model is roughly 200 mm2 and a Mx Max is roughly 400 mm2.Apple is going the chiplet route for 2nm node chips, but I thought their hand was forced because reticle sizes (or max die sizes for 2nm nodes and beyond) are decreasing because of limits from the lithography machines, not designer choice. -
Apple Silicon's success helped AMD make Ryzen AI Max chips
There isn't anything to crow about here, either from Apple or AMD. Transistor budgets roughly double every 2 years or so. Having more and more dedicated function units added to the "CPU" has been a process that is ongoing for the past 40 years. NPUs are just the latest thing, with a lot of hype. In another time, they'd just be called specialized SIMD units.
And, AMD has a lot of experience putting higher performance GPUs into an SoC. They provided the SoCs for both PS5 and XBox X-series, or in their language, APUs. There's a lot of technical heritage there.
Management likely needs to be convinced to make a high performance x86 APU for PC laptops, though. I'd bet AMD managers are thinking it is crazy to spend a lot of R&D on a high performance APU or SoC in the laptop market. AMD seems to be failing or having a down turn in this market. It's a hyper mature market where the vast majority of laptops are neutered $600 devices that doesn't require much of a GPU at all. They are competing for a pretty small slice with very little margins.
AMD is way way behind in the AI accelerator market. These are like $5000 modules that has been in hyper demand for the past couple of years, and is slated to grow. These are really high margin products. AMD not trying to cut into that market seems like a troublesome path. Those margins will pay for everything else. -
Apple ceases iPhone 14, third-gen iPhone SE sales in the EU
nubus said:thrang said:Umm, so we really want the EU or other governments to start directing product development?
This time it is about Apple producing e-waste and letting taxpayers pay. Apple agreed 15 years ago to fix it but did nothing. What would you have done?
The EU's USBC mandate isn't doing anything regarding e-waste. In terms of e-waste, only difference is that what used to be Lightning cable e-waste in the EU has now turned into USBC cable e-waste. It won't be less wasteful until phone companies stop putting USBC cables in the box. Apple, who is the most likely to stop putting USBC cables in the box, probably will ship a USBC cable in the box for the next 3 to 5 years. The higher the cost Apple product, the longer it will ship with a USBC cable.
For any high cost product, a USBC cable is going to be in the box for the foreseeable future. Some low cost products may not come with USBC cables in the future, but that is a long road ahead. I just recently bought, and returned, a Bluetooth Keychron mouse for $40. It came with 2.4 GHz wireless USBA transceiver, a USBC cable, a USBC C to A adaptor, and a USB A to C adaptor. It was intended to be Bluetooth mouse.
The prevalence of wireless 2.4 GHz peripheral connections in the PC world is basically driven by Bluetooth not being available on all PCs in the past; and, Windows' Bluetooth UI probably sucks, and it is easier to just plug in the Wireless-G USBA dongle for wireless mice than to connect through Bluetooth. It seems every Bluetooth mouse for Windows comes with 2.4 GHz dongles. Meanwhile, virtually every computing device has Bluetooth! Argh!
Anyways, to reduce e-waste, gov'ts have to mandate OEMs to take back their used stuff and recycle them. The EU has something like this, but they need to be stronger measures. Or, have an actual gov't recycling program that they do themselves. Not ship and dump to some other country with a promise of recycling, but it needs to be done in our own backyards.
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M5 Pro may separate out GPU and CPU for new server-grade performance
9secondkox2 said:Doesn't make sense. It's already server-grade packaging. Perhaps better than other server-grade packaging.
I can think of 3 reasons this would make sense:
1. If Apple is combining their silicon with third party chips from Nvidia or semthing.
2. Alternatively, another way it could make sense is if Apple is looking to add more GPU cores to various iterations of its chips, without increasign CPU core counts. i.e. having multiple sets of max/Ultra chips - one set for laptops, one for Mac Studio, and another for Mac Pro.
or...
3. Appel could be redoing the way it tiers its chip lineup. CPU could be the same, but GPU would be different for each tier.
Interesting to see how this develops.Eg, TSMC can’t make a 400+ mm2 chip like the M4 Max at 2nm. It’s physical limit of the lithography machines. Moreover, costs per transistor won’t be scaling down as fast as transistors per mm2 is scaling up. SRAM in particular has already started seeing limited scaling at 5 nm. So challenges ahead.As such, all chip designs are headed to stacking, silicon bridging or both. This particular tech looks to be a thru-silicon-vias (TSV), where the signaling between stacked chips is done through boring through the stack of chips and putting a wire down through it.
So basically, like HBM but with logic chips or mix and matching? There’s going to be chip scale heat transfer plates sandwiched between layers eventually.