Except for the MacBook Air and the current iMac (both use custom chips from Intel), The Mac mini, the MacBook, the MacBook Pro and the Mac Pro use generic components from Intel. They may not use all the add-ons Intel offers, but the cpus, the northbriges and the southbridges used are generic components.
The $1,000,000 question is has Apple gotten the Intel processors and other components it needs ahead of the competition? I wouldn't bet against it.
The bottom line is that a new MBP will soon be with us, even if it is delayed, it shouldn't be more than a few weeks, a month tops.
Thanks Tailpipe for the hope.
I'm on the market for a new MBP today. The more I wait, the more TechGirl's refurbished MBP + skip Montevina to Nehalem thing grows on me. We'll see which one comes first.
Just because the new processors are delayed doesn't mean they can't update the case. I really hope the MacBook Air will look like a giant MacBook Air! (with the power button away from the speeaker, aaand, an optional silver keyboard)
Except for the MacBook Air and the current iMac (both use custom chips from Intel), The Mac mini, the MacBook, the MacBook Pro and the Mac Pro use generic components from Intel. They may not use all the add-ons Intel offers, but the cpus, the northbriges and the southbridges used are generic components.
But you ignored #2 with which I will gore your argument with now.
Do you always agree with an idea while calling the original idea wrong? It's not very effective logic.
The add-ons you try to warp the playing field with are the rest of the chipset marketed as a unit. So if you don't have all the "ad-ons" you don't have the marketed chipset. Period. No other way to cut it.
And that my not so friendly friend is the whole point! Apple has not used Intel's full-set marketed chipsets, ever. And this thread is worried about the delay of the full chipset, which is only really delayed because Intel is waiting for FCC approval on the wireless component chip, which Apple doesn't use anyway. So the other components of that Centrino set which Apple will use are already ready to ship should Apple want them now.
Just because the new processors are delayed doesn't mean they can't update the case. I really hope the MacBook Air will look like a giant MacBook Air! (with the power button away from the speeaker, aaand, an optional silver keyboard)
The processors are not delayed. The wireless component of the Centrino chipset is. Delaying the shipping of the chipset.
Apple does not use the full Centrino chipset nor have they previously used Intel's wireless chip in a MBP so there is a lot of FUD going on in this thread for nothing.
The processors are not delayed. The wireless component of the Centrino chipset is. Delaying the shipping of the chipset.
Apple does not use the full Centrino chipset nor have they previously used Intel's wireless chip in a MBP so there is a lot of FUD going on in this thread for nothing.
also apple does not have to use intels POS gma video. And at $1500 that is a big no no.
That just goes to show how bad intel is at video chips and I don't think there cpu+gpu will work that good vs the AMD one even if the cpu part is slower the video part will blow intel away.
But you ignored #2 with which I will gore your argument with now.
Do you always agree with an idea while calling the original idea wrong? It's not very effective logic.
The add-ons you try to warp the playing field with are the rest of the chipset marketed as a unit. So if you don't have all the "ad-ons" you don't have the marketed chipset. Period. No other way to cut it.
And that my not so friendly friend is the whole point! Apple has not used Intel's full-set marketed chipsets, ever. And this thread is worried about the delay of the full chipset, which is only really delayed because Intel is waiting for FCC approval on the wireless component chip, which Apple doesn't use anyway. So the other components of that Centrino set which Apple will use are already ready to ship should Apple want them now.
Quote:
Originally Posted by Hiro
The processors are not delayed. The wireless component of the Centrino chipset is. Delaying the shipping of the chipset.
Apple does not use the full Centrino chipset nor have they previously used Intel's wireless chip in a MBP so there is a lot of FUD going on in this thread for nothing.
Am I the only one who can read, here?
Quote:
On July 14, the first PM chipsets (which use discrete graphics processors) will appear, along with Core 2 Duo and Core 2 Extreme Mobile CPUs. GM chipsets (integrated graphics) won't hit the market until August, as the spokesperson said Intel needs to rescreen all of the Montevina integrated graphics chipsets.
The PM/GM chipsets don't include any wireless module or other add-on, those are just the north and south bridges. So, it doesn't matter if the MBP doesn't use Intel's integrated graphics or wireless modules.
If Apple planned to release a MBP with Montevina-based cpus and the PM chipset, it doesn't look like they will be able to ship those before mid-July, making it unlikely for a WWDC announcement.
Does it always take apple a month or more to implement and release new chips? In other words, is it pretty for-sure that it won't be until August that a montevina MB and MBP will see the light of day?
The bad news does not stop there....Or should I say Rumors...The 3G Iphone may be introduced on the 9th but rumor has it that due to other delays such as getting FCC approval and various component shortages the release wont be until late August or early September...Unfortunately placing it behind the release of the new Blackberries....Now that hurts...
No. You do seem to be one who fires without proof though.
Quote:
The PM/GM chipsets don't include any wireless module or other add-on, those are just the north and south bridges. So, it doesn't matter if the MBP doesn't use Intel's integrated graphics or wireless modules.
Here is direct contradiction of that: http://www.intel.com/products/chipse...65_diagram.htm. Each of the colored (non-gray) nodes is included in the chipset family. The rest of the document is here since the graphics back link wont work from a direct link.
Intel uses PM to signify a chipset that supports external graphics and GM to signify integrated graphics. PM/GM are for nomenclature for full chipsets. Your northbridge/southbridges are named I/O Controller Hubs when referred to independently from the CPU and rest of the chipset (the red & pink nodes).
Go find a rube that will roll over when you say Boo! You're played out.
No. You do seem to be one who fires without proof though.
Here is direct contradiction of that: http://www.intel.com/products/chipse...65_diagram.htm. Each of the colored (non-gray) nodes is included in the chipset family. The rest of the document is here since the graphics back link wont work from a direct link.
Intel uses PM to signify a chipset that supports external graphics and GM to signify integrated graphics. PM/GM are for nomenclature for full chipsets. Your northbridge/southbridges are named I/O Controller Hubs when referred to independently from the CPU and rest of the chipset (the red & pink nodes).
Go find a rube that will roll over when you say Boo! You're played out.
Again you're wrong, all the blue parts are optional items (with different part numbers), you need some/all of those to have some kind of certification: Centrino, Centrino vPro, etc.
the 82GM965 (MCH) or northbridge (with integrated graphics),
and the 82801HBM/HEM (ICH8-M) or southbridge.
For both, go down the "Packaging information" section.
In the quote that I provided many time, the Intel's spokesman talked about the PM, GM and Core 2 duo and extreme cpus being delayed not the Centrino, VPro or other ensemble of chips and chipsets.
And by the way, the northbridge is not a I/O controller hub (ICH), it is a memory controller hub (MCH). I thought you were aware of the difference.
Again you're wrong, all the blue parts are optional items (with different part numbers), you need some/all of those to have some kind of certification: Centrino, Centrino vPro, etc.
the 82GM965 (MCH) or northbridge (with integrated graphics),
and the 82801HBM/HEM (ICH8-M) or southbridge.
For both, go down the "Packaging information" section.
In the quote that I provided many time, the Intel's spokesman talked about the PM, GM and Core 2 duo and extreme cpus being delayed not the Centrino, VPro or other ensemble of chips and chipsets.
And by the way, the northbridge is not a I/O controller hub (ICH), it is a memory controller hub (MCH). I thought you were aware of the difference.
There aren't enough smilies for how hard I am laughing!
The packaging information isn't what's in he box! It's the ceramic pinout grid the die for the two large non-standardized components are mounted in! The other components are not "packaged", they are leaf components which adhere to their individual ISO/IEEE class interface standards which already delimitate the pinouts explicitly so the specifics don't need to be delineated again.
And no, blue does not represent "optional". Or are you trying to say the CPU is optional now too when you said earlier the PM/GM chipset was CPU+NB+SB? You can't even remain consistent! It's also quite obvious you did not even read the whole comparison link you posted. Fixating on Intel Turbo Memory listed as an option for the PCI-E bus. ALL the others are ✓ indicating "included".
O,h I do so admire the balls of blindly (stupidly perhaps?) citing my own top-level link as proof! Then adding another that so effectively shoots your own argument in the foot. You haven't even risen to the Google 3 minutes and blather level of faux-self-designated-expert.
Since I am still waiting for my next appointment, I'll take the time to reply to you.
Of course the packaging information is not "what's in the box", this section lists the packaging of the two (and only) components of the chipset (the northbridge and the southbridge).
The link I offered is an illustration of the Centrino, vPro certifications that indeed need the wireless and other modules to be given, but even then, you have the choice of the modules, making them optional if you don't want/need those certifications.
If you need more information on what the 965 express chipset is all about, I suggest you go right to its datasheet (pdf format) and you will see that there is no wireless/wired modules included.
The cpu is indeed optional when you are manufacturing a computer, because you can choose the one you want, for some CHIPSETS you can even use DIFFERENT families of CPUs.
I've never said that the CPU was part of the chipset neither, all I said is that the PM chipset and the associated cpus were both delayed.
Quote:
The PM/GM chipsets don't include any wireless module or other add-on, those are just the north and south bridges.
I believe you're the one with the fixation of being right even when you're not.
In case some of the readers wanted a summary of all this:
CPU = CPU (core 2 duo T7500 for exemple)
PM chipset = MCH (memory controller hub or northbridge) with discrete graphics link + ICH (i/o controller hub or southbridge)
GM chipset = MCH (memory controller hub or northbridge) with INTEGRATED graphics + ICH (i/o controller hub or southbridge)
Centrino, Centrino vPro = Intel's certified platforms, including a CPU, a GM/PM chipset, and some certified modules, like an Intel wireless module, for example.
Look here, a comparison between two generations of the 9xx chipset. See any mention of wireless? No. That's because the 9xx chipset doesn't include wireless.
The "Centrino" platform consists of a 9xx chipset (northbridge + southbridge), a CPU and Intel's wireless chip.
A 9xx by itself is not Centrino as you seem to be suggesting.
Look here, a comparison between two generations of the 9xx chipset. See any mention of wireless? No. That's because the 9xx chipset doesn't include wireless.
The "Centrino" platform consists of a 9xx chipset (northbridge + southbridge), a CPU and Intel's wireless chip.
A 9xx by itself is not Centrino as you seem to be suggesting.
That's not what I have been suggesting at all. I have said all along that Centrino is a full chipset, not just a CPU+NB+SB. And because of that a Centrino delay does not force a CPU or NB/SB delay because the wireless module has not ben certified. mjteix originally stated "Whatever way you name it, it seems that all the components of "Centrino 2" have been delayed." I categorically say bunk.
I do see my error on the PM/GM chipset issue. The diagram contained within the datasheet, which is what I linked previously, is a Centrino diagram showing where the PM/GM chipset sits within the Centrino standard. I mistakenly took that and the datasheet references to wireless control as indicating the whole diagram referred to the PM/GM chisets. This error does not in the least change anything on the basic point we have both been in agreement on, that Centrino is larger than the CPU+NB+SB. Those three are the set of components Intel needs to engineer an Apple motherboard, the rest of the MB components are ala carte.
Apple and Intel negotiate delivery schedules which are not tied to open market shipping dates. Apple gets no automatic early deliveries, but are also not restricted to waiting with everyone else. Intel occaionally provides Apple components "early" or first when Apple is willing to give Intel something for the honor and it is displayed to be in Intel's best interest to do so. Apple tends to release when they are ready and sometimes that is after wider Intel component shipping, and sometimes it is earlier.
Since Intel's source to Ars was talking about the Centrino delay driven by wireless problems and integrated graphics problems, it isn't the least bit surprising that the PM-based version and GM-based versions were broken out as different. Their respective delays were different and the information merely indicates why from a Centrino perspective.
There has been no general statement that the Penryn CPU, nor the associted northbridge and southbridge themselves are delayed. Actually the Intel source went out of it's way to state specifically what the two components of the delay were, and neither were anything that will prevent Apple from including a Penryn CPU in a MBP when it chooses to ship one.
That's not what I have been suggesting at all. I have said all along that Centrino is a full chipset, not just a CPU+NB+SB. And because of that a Centrino delay does not force a CPU or NB/SB delay because the wireless module has not ben certified. mjteix originally stated "Whatever way you name it, it seems that all the components of "Centrino 2" have been delayed." I categorically say bunk.
Nice one, Hiro.
What you say confirms exactly what I've been hearing. For all these reasons, I believe we may well see a new MacBook Pro announced next week despite rumours to the contrary.
What we probably won't see is a new MacBook. What this discussion seems to confirm is that the chipsets in the MacBook Pro and MacBook will be quite separate maintaining the distinction between the two ranges.
If for any reason the new MBP doesn't make an appearance in 7 days time, it will only be a matter of time before it arrives.
Most sources say Centrino 2 was delayed until July 14 due to problems with the wireless component.
But nothing I've read says the new processors are delayed, and are launching in late June. If that's true, the northbridge and southbridge chips will be launching with them, and that's all Apple cares about.
...And that my not so friendly friend is the whole point! Apple has not used Intel's full-set marketed chipsets, ever. And this thread is worried about the delay of the full chipset, which is only really delayed because Intel is waiting for FCC approval on the wireless component chip, which Apple doesn't use anyway. So the other components of that Centrino set which Apple will use are already ready to ship should Apple want them now.
Some very interesting discussions on this thread. My personal feeling is if Intel doesn't have its whole lock-stock-barrel solution ready to go, then this does put a delay onto all the vendors, even *if* said vendors are only using certain parts of this platform.
This doesn't mean that a non-Montevina MacBook Pro would not be announced in the next few weeks. If you get my drift...
There is a very small possibility that an updated MacBook will be announced at WWDC, but it is very, very, very unlikely to be shipping immediately (pretty much the only way that could happen is if it doesn't use Intel's integrated graphics any more).
There is a medium possibility that an updated MacBook Pro will be announced at WWDC, and a medium likelihood that it will be shipping immediately.
IMHO, WWDC is going to be all about iPhone 2 (aka 3G iPhone) and that there will be a separate "special event" sometime before the end of July to introduce the new MacBook and MacBook Pro.
Comments
am one cynical, meticulous, SOB.
I will agree with 1 and 3.
Except for the MacBook Air and the current iMac (both use custom chips from Intel), The Mac mini, the MacBook, the MacBook Pro and the Mac Pro use generic components from Intel. They may not use all the add-ons Intel offers, but the cpus, the northbriges and the southbridges used are generic components.
The $1,000,000 question is has Apple gotten the Intel processors and other components it needs ahead of the competition? I wouldn't bet against it.
The bottom line is that a new MBP will soon be with us, even if it is delayed, it shouldn't be more than a few weeks, a month tops.
Thanks Tailpipe for the hope.
I'm on the market for a new MBP today. The more I wait, the more TechGirl's refurbished MBP + skip Montevina to Nehalem thing grows on me. We'll see which one comes first.
Link
I will agree with 1 and 3.
Except for the MacBook Air and the current iMac (both use custom chips from Intel), The Mac mini, the MacBook, the MacBook Pro and the Mac Pro use generic components from Intel. They may not use all the add-ons Intel offers, but the cpus, the northbriges and the southbridges used are generic components.
But you ignored #2 with which I will gore your argument with now.
Do you always agree with an idea while calling the original idea wrong? It's not very effective logic.
The add-ons you try to warp the playing field with are the rest of the chipset marketed as a unit. So if you don't have all the "ad-ons" you don't have the marketed chipset. Period. No other way to cut it.
And that my not so friendly friend is the whole point! Apple has not used Intel's full-set marketed chipsets, ever. And this thread is worried about the delay of the full chipset, which is only really delayed because Intel is waiting for FCC approval on the wireless component chip, which Apple doesn't use anyway. So the other components of that Centrino set which Apple will use are already ready to ship should Apple want them now.
Just because the new processors are delayed doesn't mean they can't update the case. I really hope the MacBook Air will look like a giant MacBook Air! (with the power button away from the speeaker, aaand, an optional silver keyboard)
The processors are not delayed. The wireless component of the Centrino chipset is. Delaying the shipping of the chipset.
Apple does not use the full Centrino chipset nor have they previously used Intel's wireless chip in a MBP so there is a lot of FUD going on in this thread for nothing.
The processors are not delayed. The wireless component of the Centrino chipset is. Delaying the shipping of the chipset.
Apple does not use the full Centrino chipset nor have they previously used Intel's wireless chip in a MBP so there is a lot of FUD going on in this thread for nothing.
also apple does not have to use intels POS gma video. And at $1500 that is a big no no.
That just goes to show how bad intel is at video chips and I don't think there cpu+gpu will work that good vs the AMD one even if the cpu part is slower the video part will blow intel away.
But you ignored #2 with which I will gore your argument with now.
Do you always agree with an idea while calling the original idea wrong? It's not very effective logic.
The add-ons you try to warp the playing field with are the rest of the chipset marketed as a unit. So if you don't have all the "ad-ons" you don't have the marketed chipset. Period. No other way to cut it.
And that my not so friendly friend is the whole point! Apple has not used Intel's full-set marketed chipsets, ever. And this thread is worried about the delay of the full chipset, which is only really delayed because Intel is waiting for FCC approval on the wireless component chip, which Apple doesn't use anyway. So the other components of that Centrino set which Apple will use are already ready to ship should Apple want them now.
The processors are not delayed. The wireless component of the Centrino chipset is. Delaying the shipping of the chipset.
Apple does not use the full Centrino chipset nor have they previously used Intel's wireless chip in a MBP so there is a lot of FUD going on in this thread for nothing.
Am I the only one who can read, here?
On July 14, the first PM chipsets (which use discrete graphics processors) will appear, along with Core 2 Duo and Core 2 Extreme Mobile CPUs. GM chipsets (integrated graphics) won't hit the market until August, as the spokesperson said Intel needs to rescreen all of the Montevina integrated graphics chipsets.
The PM/GM chipsets don't include any wireless module or other add-on, those are just the north and south bridges. So, it doesn't matter if the MBP doesn't use Intel's integrated graphics or wireless modules.
If Apple planned to release a MBP with Montevina-based cpus and the PM chipset, it doesn't look like they will be able to ship those before mid-July, making it unlikely for a WWDC announcement.
**********
I still only agree on #1 and #3.
Does it always take apple a month or more to implement and release new chips? In other words, is it pretty for-sure that it won't be until August that a montevina MB and MBP will see the light of day?
The bad news does not stop there....Or should I say Rumors...The 3G Iphone may be introduced on the 9th but rumor has it that due to other delays such as getting FCC approval and various component shortages the release wont be until late August or early September...Unfortunately placing it behind the release of the new Blackberries....Now that hurts...
Am I the only one who can read, here?
No. You do seem to be one who fires without proof though.
The PM/GM chipsets don't include any wireless module or other add-on, those are just the north and south bridges. So, it doesn't matter if the MBP doesn't use Intel's integrated graphics or wireless modules.
Here is direct contradiction of that: http://www.intel.com/products/chipse...65_diagram.htm. Each of the colored (non-gray) nodes is included in the chipset family. The rest of the document is here since the graphics back link wont work from a direct link.
Intel uses PM to signify a chipset that supports external graphics and GM to signify integrated graphics. PM/GM are for nomenclature for full chipsets. Your northbridge/southbridges are named I/O Controller Hubs when referred to independently from the CPU and rest of the chipset (the red & pink nodes).
Go find a rube that will roll over when you say Boo! You're played out.
No. You do seem to be one who fires without proof though.
Here is direct contradiction of that: http://www.intel.com/products/chipse...65_diagram.htm. Each of the colored (non-gray) nodes is included in the chipset family. The rest of the document is here since the graphics back link wont work from a direct link.
Intel uses PM to signify a chipset that supports external graphics and GM to signify integrated graphics. PM/GM are for nomenclature for full chipsets. Your northbridge/southbridges are named I/O Controller Hubs when referred to independently from the CPU and rest of the chipset (the red & pink nodes).
Go find a rube that will roll over when you say Boo! You're played out.
Again you're wrong, all the blue parts are optional items (with different part numbers), you need some/all of those to have some kind of certification: Centrino, Centrino vPro, etc.
http://www.intel.com/products/centri...source_compare
In your example, the PM chipset is comprised of:
the 82PM965 (MCH) or northbridge,
and the 82801HBM/HEM (ICH8-M) or southbridge.
The GM chipset being comprised of:
the 82GM965 (MCH) or northbridge (with integrated graphics),
and the 82801HBM/HEM (ICH8-M) or southbridge.
For both, go down the "Packaging information" section.
In the quote that I provided many time, the Intel's spokesman talked about the PM, GM and Core 2 duo and extreme cpus being delayed not the Centrino, VPro or other ensemble of chips and chipsets.
And by the way, the northbridge is not a I/O controller hub (ICH), it is a memory controller hub (MCH). I thought you were aware of the difference.
Again you're wrong, all the blue parts are optional items (with different part numbers), you need some/all of those to have some kind of certification: Centrino, Centrino vPro, etc.
http://www.intel.com/products/centri...source_compare
In your example, the PM chipset is comprised of:
the 82PM965 (MCH) or northbridge,
and the 82801HBM/HEM (ICH8-M) or southbridge.
The GM chipset being comprised of:
the 82GM965 (MCH) or northbridge (with integrated graphics),
and the 82801HBM/HEM (ICH8-M) or southbridge.
For both, go down the "Packaging information" section.
In the quote that I provided many time, the Intel's spokesman talked about the PM, GM and Core 2 duo and extreme cpus being delayed not the Centrino, VPro or other ensemble of chips and chipsets.
And by the way, the northbridge is not a I/O controller hub (ICH), it is a memory controller hub (MCH). I thought you were aware of the difference.
There aren't enough smilies for how hard I am laughing!
The packaging information isn't what's in he box! It's the ceramic pinout grid the die for the two large non-standardized components are mounted in! The other components are not "packaged", they are leaf components which adhere to their individual ISO/IEEE class interface standards which already delimitate the pinouts explicitly so the specifics don't need to be delineated again.
And no, blue does not represent "optional". Or are you trying to say the CPU is optional now too when you said earlier the PM/GM chipset was CPU+NB+SB? You can't even remain consistent! It's also quite obvious you did not even read the whole comparison link you posted. Fixating on Intel Turbo Memory listed as an option for the PCI-E bus. ALL the others are ✓ indicating "included".
O,h I do so admire the balls of blindly (stupidly perhaps?) citing my own top-level link as proof! Then adding another that so effectively shoots your own argument in the foot.
bla bla bla
Since I am still waiting for my next appointment, I'll take the time to reply to you.
Of course the packaging information is not "what's in the box", this section lists the packaging of the two (and only) components of the chipset (the northbridge and the southbridge).
The link I offered is an illustration of the Centrino, vPro certifications that indeed need the wireless and other modules to be given, but even then, you have the choice of the modules, making them optional if you don't want/need those certifications.
If you need more information on what the 965 express chipset is all about, I suggest you go right to its datasheet (pdf format) and you will see that there is no wireless/wired modules included.
The cpu is indeed optional when you are manufacturing a computer, because you can choose the one you want, for some CHIPSETS you can even use DIFFERENT families of CPUs.
I've never said that the CPU was part of the chipset neither, all I said is that the PM chipset and the associated cpus were both delayed.
The PM/GM chipsets don't include any wireless module or other add-on, those are just the north and south bridges.
I believe you're the one with the fixation of being right even when you're not.
In case some of the readers wanted a summary of all this:
CPU = CPU (core 2 duo T7500 for exemple)
PM chipset = MCH (memory controller hub or northbridge) with discrete graphics link + ICH (i/o controller hub or southbridge)
GM chipset = MCH (memory controller hub or northbridge) with INTEGRATED graphics + ICH (i/o controller hub or southbridge)
Centrino, Centrino vPro = Intel's certified platforms, including a CPU, a GM/PM chipset, and some certified modules, like an Intel wireless module, for example.
Look here, a comparison between two generations of the 9xx chipset. See any mention of wireless? No. That's because the 9xx chipset doesn't include wireless.
The "Centrino" platform consists of a 9xx chipset (northbridge + southbridge), a CPU and Intel's wireless chip.
A 9xx by itself is not Centrino as you seem to be suggesting.
Hiro, you are wrong and mjteix is right.
Look here, a comparison between two generations of the 9xx chipset. See any mention of wireless? No. That's because the 9xx chipset doesn't include wireless.
The "Centrino" platform consists of a 9xx chipset (northbridge + southbridge), a CPU and Intel's wireless chip.
A 9xx by itself is not Centrino as you seem to be suggesting.
That's not what I have been suggesting at all. I have said all along that Centrino is a full chipset, not just a CPU+NB+SB. And because of that a Centrino delay does not force a CPU or NB/SB delay because the wireless module has not ben certified. mjteix originally stated "Whatever way you name it, it seems that all the components of "Centrino 2" have been delayed." I categorically say bunk.
I do see my error on the PM/GM chipset issue. The diagram contained within the datasheet, which is what I linked previously, is a Centrino diagram showing where the PM/GM chipset sits within the Centrino standard. I mistakenly took that and the datasheet references to wireless control as indicating the whole diagram referred to the PM/GM chisets. This error does not in the least change anything on the basic point we have both been in agreement on, that Centrino is larger than the CPU+NB+SB. Those three are the set of components Intel needs to engineer an Apple motherboard, the rest of the MB components are ala carte.
Apple and Intel negotiate delivery schedules which are not tied to open market shipping dates. Apple gets no automatic early deliveries, but are also not restricted to waiting with everyone else. Intel occaionally provides Apple components "early" or first when Apple is willing to give Intel something for the honor and it is displayed to be in Intel's best interest to do so. Apple tends to release when they are ready and sometimes that is after wider Intel component shipping, and sometimes it is earlier.
Since Intel's source to Ars was talking about the Centrino delay driven by wireless problems and integrated graphics problems, it isn't the least bit surprising that the PM-based version and GM-based versions were broken out as different. Their respective delays were different and the information merely indicates why from a Centrino perspective.
There has been no general statement that the Penryn CPU, nor the associted northbridge and southbridge themselves are delayed. Actually the Intel source went out of it's way to state specifically what the two components of the delay were, and neither were anything that will prevent Apple from including a Penryn CPU in a MBP when it chooses to ship one.
That's not what I have been suggesting at all. I have said all along that Centrino is a full chipset, not just a CPU+NB+SB. And because of that a Centrino delay does not force a CPU or NB/SB delay because the wireless module has not ben certified. mjteix originally stated "Whatever way you name it, it seems that all the components of "Centrino 2" have been delayed." I categorically say bunk.
Nice one, Hiro.
What you say confirms exactly what I've been hearing. For all these reasons, I believe we may well see a new MacBook Pro announced next week despite rumours to the contrary.
What we probably won't see is a new MacBook. What this discussion seems to confirm is that the chipsets in the MacBook Pro and MacBook will be quite separate maintaining the distinction between the two ranges.
If for any reason the new MBP doesn't make an appearance in 7 days time, it will only be a matter of time before it arrives.
http://www.fudzilla.com/index.php?op...=7605&Itemid=1
Does this article have any credibility?
http://www.fudzilla.com/index.php?op...=7605&Itemid=1
Most sources say Centrino 2 was delayed until July 14 due to problems with the wireless component.
But nothing I've read says the new processors are delayed, and are launching in late June. If that's true, the northbridge and southbridge chips will be launching with them, and that's all Apple cares about.
...And that my not so friendly friend is the whole point! Apple has not used Intel's full-set marketed chipsets, ever. And this thread is worried about the delay of the full chipset, which is only really delayed because Intel is waiting for FCC approval on the wireless component chip, which Apple doesn't use anyway. So the other components of that Centrino set which Apple will use are already ready to ship should Apple want them now.
Some very interesting discussions on this thread. My personal feeling is if Intel doesn't have its whole lock-stock-barrel solution ready to go, then this does put a delay onto all the vendors, even *if* said vendors are only using certain parts of this platform.
This doesn't mean that a non-Montevina MacBook Pro would not be announced in the next few weeks.
No Mac laptop has ever been "Centrino".
There is a very small possibility that an updated MacBook will be announced at WWDC, but it is very, very, very unlikely to be shipping immediately (pretty much the only way that could happen is if it doesn't use Intel's integrated graphics any more).
There is a medium possibility that an updated MacBook Pro will be announced at WWDC, and a medium likelihood that it will be shipping immediately.
IMHO, WWDC is going to be all about iPhone 2 (aka 3G iPhone) and that there will be a separate "special event" sometime before the end of July to introduce the new MacBook and MacBook Pro.