tenthousandthings

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tenthousandthings
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  • AMD proved that Apple skipping 4nm chips isn't a big deal

    I realize the forums are a tiny aspect of Apple Insider, and it's a giant pain in the ass to moderate them, but this article/editorial contains two factual errors that have already been addressed repeatedly in the comments on earlier articles that made the same mistake—if the author had read those comments, he could have made a stronger argument here.

    First and foremost, the A16 is 4nm. Apple stated that outright. It is the N4 process. The linked The Information article AI covered on December 23 may have some elements of truth in it. After all, chipmaking is hard, or everyone would be doing it. Especially high-end graphics. The quote from Ian Cutress therein says all that needs to be said. But it's Apple Insider who makes the leap there to say that the A16 stayed on 5nm and didn't go to 4nm because of these challenges. That is just wrong, wrong, wrong. The A16 did go to 4nm (N4). Apple touted this in its presentation. I find this insistence otherwise, in multiple articles by two different members of the AI staff (Wesley twice and now Malcolm), to be just inexplicable.

    The second error is more of a detail, but it's an important one if you're going to be editorializing about Apple and chipmaking. TSMC's so-called "4nm" is the third generation of its 5nm (N5) FinFET platform. It's not a "die shrink," to reference Malcolm's 2019 article where he laid out some of the factors driving Apple's A-series chip production. It uses the same design library. N4 is a second "Tock" not a "Tick," to use the same terms Malcolm used in 2019. That's why Apple could easily revert to the A15 graphics designs for A16 (while staying with N4 for A16, instead of N5P used for the A15), as rumored/leaked in the aforementioned The Information article.

    TSMC provides a definitive English-language source of information about how these “process technologies” relate to one another: https://www.tsmc.com/english/dedicatedFoundry/technology/logic

    The N5 FinFET platform is comprised of N5, N5P, N4, N4P, and N4X processes. The next platform is N3, and it is more "flexible." The first two generations of it are N3 and N3E. See: https://n3.tsmc.com/english/dedicatedFoundry/technology/N3.htm

    N2 (due in 2025) was recently announced, but it's not clear how it is related to N3—I'll guess that means the relationship between N3 and N2 is similar to the relationship between N5 and N4, that is, N2 will use the N3 FinFlex design library.
    thtnetlingdewmemuthuk_vanalingamgatorguytdknoxxyzzy01racerhomie3bestkeptsecretwatto_cobra
  • Apple considering 2025 debut of touchscreen MacBook Pro

    This will replace the 13" Touch Bar MBP, and fill the same spot in the marketing/pricing lineup.
    williamlondonwatto_cobra9secondkox2
  • Apple Silicon Mac Pro in testing with macOS 13.3

    And let’s not forget the 2019 Mac Pro was announced just a year before the Apple Silicon announcement. The launch was less than six months before. It makes perfect sense that it would have been designed for Apple Silicon from the start. 
    watto_cobradarkvader9secondkox2
  • Early M2 Max benchmarks may have just leaked online

    I've been waiting for a thread to post this in, I guess it can go here. The tl;dr version is there has been one other unusual, long time interval in the past history of Apple Silicon, between the A10 and the A10X, and that is the only case where Apple switched process nodes in between. This fact could indicate that the reason for the similarly long interval between the M2 and the M2Pro/Max (at least) is because of a process node change.

    Below is a history of the A-Series and M-series to date. This is selective, but everything here is accurate and known, not speculative. I don't track every device. For Macs, I only note those that are not transitional. For example, for the M1 I only list the iMac 24" -- every other M1 Mac was transitional. I also track the TSMC process nodes.

    A4 (March 2010) iPad 1 :: iPhone 4
    A5 (March 2011) iPad 2 :: iPhone 4S
    A5X (March 2012) iPad 3 

    A6 (September 2012) iPhone 5
    A6X (October 2012) iPad 4

    A7 (September 2013) iPhone 5S :: iPad Air 1

    A8 (September 2014) iPhone 6 [TSMC 20nm]
    A8X (October 2014) iPad Air 2 [TSMC 20nm]

    A9 (September 2015) iPhone 6S :: iPad 5 [TSMC 16nm]
    A9X (November 2015) iPad Pro 1 [TSMC 16nm]

    A10 (September 2016) iPhone 7 :: iPad 6 :: iPad 7 [TSMC 16nm gen3]
    A10X (June 2017) iPad Pro 2 [TSMC 10nm]

    A11 (September 2017) iPhone 8, iPhone X [TSMC 10nm]

    A12 (September 2018) iPhone XS :: iPad Air 3 :: iPad 8 [TSMC 7nm gen1 "N7"]
    A12X (October 2018) iPad Pro 3 [TSMC 7nm gen1 "N7"]
    A12Z (March 2020) iPad Pro 4 :: Developer Transition Kit [TSMC 7nm gen1 "N7"]

    A13 (September 2019) iPhone 11 :: iPad 9 [TSMC 7nm gen2 "N7P" (P = Plus)]

    A14 (October 2020) iPhone 12 :: iPad Air 4 :: iPad 10 [TSMC 5nm gen1 "N5"]
    M1 (November 2020) iMac 24" :: iPad Pro 5 [TSMC 5nm gen1 "N5"]
    M1 Pro/Max (October 2021) MacBook Pro 14" 16" [TSMC 5nm gen1 "N5"]
    M1 Ultra (March 2022) Mac Studio [TSMC 5nm gen1 "N5"]

    A15 (September 2021) iPhone 13 :: iPhone 14 [TSMC 5nm gen2 "N5P"]
    M2 (June 2022) MacBook Air 4 :: iPad Pro 6 [TSMC 5nm gen2 "N5P"]

    A16 (September 2022) iPhone 14 Pro [TSMC 5nm gen3 "N4"]

    Notice the long time interval between the A10 and the A10X. In every other case (the A6/A6X, A8/A8X, A9/A9X, and A12/A12X), there is one month between the release of the flagship iPhone SoC and the flagship iPad SoC. Only the A10 and A10X have a nine-month gap between them. How is that different from the others? It's the only one with a process node change. Moreover, it's a big jump, from the third generation of TSMC's 16nm node to its new 10nm node.

    The second thing to point out is that all of the M1 SoCs share the same process node. That's currently our only M-series data point, so we can't draw any conclusions, but I've arranged the releases in a way that highlights the fact the M-series has replaced the X variants.

    Next, a lot of speculation has been made about future 3nm TSMC process nodes. But TSMC has two still-upcoming 5nm nodes: gen4 "N4P" (P = Plus) and gen5 "N4X" (X = Extreme). The N4X node is especially intriguing with respect to a new Mac Pro: https://pr.tsmc.com/english/news/2895 -- I don't know about you, but this press release, with its emphasis on HPC, advanced packaging, and "the common design rules of the N5 process," reads like a recipe for M2 Ultra/Extreme SoCs.

    In conclusion: if the past history of the A-series is any indication, the long, likely eight- or nine-month gap between the M2 and the M2 Pro+ probably indicates a process node change. It still seems too early for TSMC's 3nm tech, so that leaves the N4P and N4X nodes. Here's a wild guess for what the end of my list above will look like prior to the start of a new cycle with the M3.

    M2 Pro/Max (March 2023) iMac 24" :: Mac mini 6 :: MacBook Pro 14" 16" [TSMC 5nm gen4 "N4P"]
    M2 Ultra/Extreme (June 2023) Mac Studio :: Mac Pro [TSMC 5nm gen5 "N4X"]
    blastdoorroundaboutnowmuthuk_vanalingamFileMakerFellerTheObannonFilewatto_cobraradarthekat
  • Intel's Thunderbolt 5 has twice the speed of Thunderbolt 4

    mpantone said:
    rob53 said:
    Not sure NVMe single blades will max out that projected speed and I can guarantee you that TB5 hardware will not be inexpensive. Article talks about 8K displays and only a bit about faster SSDs (for gaming? what about for real work like video production), which also will cost more. Higher bandwidth also ends up meaning people will want larger storage because, conceivably, faster speeds will allow more data to be pushed and stored. There is a usable limit to these speeds, which always has to do with money. You got it, you can buy it. Most consumers will never see the speed of TB5, same as now because most consumers only use USB3.x speeds instead of TB3/4 speeds because of the extra cost in making the interface hardware.
    I agree, I don't see how Joe Consumer will be able to saturate TB5 bandwidth.

    A pro certain probably could, writing multiple streams of 8K video (or other data) to a disk array with multiple NVMe drives. TB5 is intended more for that professional audience; Thunderbolt compatible hardware is already expensive.

    In any case, TB5 is still in the proposal stage. Once it's approved in its final form, there would be more activity to develop compliant hardware.

    Up until now, Thunderbolt has essentially been an externalization of the PCIe bus as far as I can tell. As PCIe bus bandwidth increases, Thunderbolt follows.
    The other major integrated elements are support for display protocols (DisplayPort) and charging. Apple needs TB5 to support a future ProMotion 8K XDR display in a single cable, and they (and the rest of the industry) are getting that.

    Apple’s original involvement was developing DisplayPort support and adapting Light Peak to support both optical cable and copper cable. To answer July’s question above, I don’t think Apple’s role is any different from the rest of the industry at this point. Here’s an early AI article about it:

    https://appleinsider.com/articles/11/02/24/intel_details_thunderbolt_as_exclusive_to_apple_until_2012
    rundhvid